公开(公告)号：US10303915B2

公开(公告)日：2019-05-28

申请号：US15864326

申请日：2018-01-08

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Wen-Chie Huang

IPC: G06K9/00 ,  G06F21/32

Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.

公开(公告)号：US20180211081A1

公开(公告)日：2018-07-26

申请号：US15864326

申请日：2018-01-08

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Wen-Chie Huang

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06F21/32 ,  G06K9/00107

Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.

公开(公告)号：US11918387B2

公开(公告)日：2024-03-05

申请号：US17112651

申请日：2020-12-04

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Chun-Chiang Chen ,  Wen-Chie Huang ,  Ming Le

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/11 ,  G08B21/02 ,  A61B5/024 ,  A61B5/08

CPC classification number: A61B5/746 ,  A61B5/0022 ,  A61B5/02055 ,  A61B5/1113 ,  A61B5/7225 ,  A61B5/7405 ,  A61B5/7455 ,  G08B21/0211 ,  G08B21/0277 ,  A61B5/02444 ,  A61B5/0816 ,  A61B5/0823 ,  A61B5/1102 ,  A61B2503/04 ,  A61B2560/0214 ,  A61B2560/0252 ,  A61B2562/0233 ,  A61B2562/0271

Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.

公开(公告)号：US12085451B2

公开(公告)日：2024-09-10

申请号：US17326289

申请日：2021-05-20

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Wen-Chie Huang ,  Yu-Chih Liang ,  Chein-Hsun Wang ,  Ming Le ,  Chen-Tang Huang ,  Chein-Hsing Yu ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/16 ,  G01J5/04 ,  G01J5/0806

CPC classification number: G01J5/16 ,  G01J5/0806 ,  G01J5/049

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.