Invention Grant
- Patent Title: Crystalline bottom electrode for perovskite capacitors and methods of fabrication
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Application No.: US16914161Application Date: 2020-06-26
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Publication No.: US12100731B2Publication Date: 2024-09-24
- Inventor: Kaan Oguz , I-Cheng Tung , Chia-Ching Lin , Sou-Chi Chang , Matthew Metz , Uygar Avci
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L49/02

Abstract:
A capacitor device, such as a metal insulator metal (MIM) capacitor includes a seed layer including tantalum, a first electrode on the seed layer, where the first electrode includes at least one of ruthenium or iridium and an insulator layer on the seed layer, where the insulator layer includes oxygen and one or more of Sr, Ba or Ti. In an exemplary embodiment, the insulator layer is a crystallized layer having a substantially smooth surface. A crystallized insulator layer having a substantially smooth surface facilitates low electrical leakage in the MIM capacitor. The capacitor device further includes a second electrode layer on the insulator layer, where the second electrode layer includes a second metal or a second metal alloy.
Public/Granted literature
- US20210408224A1 CRYSTALLINE BOTTOM ELECTRODE FOR PEROVSKITE CAPACITORS AND METHODS OF FABRICATION Public/Granted day:2021-12-30
Information query
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