Invention Grant
- Patent Title: Adhesion removal method and film-forming method
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Application No.: US17418344Application Date: 2019-12-10
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Publication No.: US12116675B2Publication Date: 2024-10-15
- Inventor: Yosuke Tanimoto , Shimon Osada
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 18240515 2018.12.25
- International Application: PCT/JP2019/048351 2019.12.10
- International Announcement: WO2020/137527A 2020.07.02
- Date entered country: 2021-06-25
- Main IPC: C23C8/08
- IPC: C23C8/08 ; H01L21/02

Abstract:
Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber (10) and the inner surface of a discharge pipe (15) connected to the chamber (10) are removed by reaction with a cleaning gas containing an oxygen-containing compound gas.
Public/Granted literature
- US20220064788A1 ADHESION REMOVAL METHOD AND FILM-FORMING METHOD Public/Granted day:2022-03-03
Information query
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