公开(公告)号：US12116675B2

公开(公告)日：2024-10-15

申请号：US17418344

申请日：2019-12-10

Applicant: SHOWA DENKO K.K.

Inventor： Yosuke Tanimoto ,  Shimon Osada

IPC: C23C8/08 ,  H01L21/02

CPC classification number: C23C8/08 ,  H01L21/02334

Abstract: Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber (10) and the inner surface of a discharge pipe (15) connected to the chamber (10) are removed by reaction with a cleaning gas containing an oxygen-containing compound gas.