Invention Grant
- Patent Title: Magnetic sensor and method for manufacturing magnetic sensor
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Application No.: US17784889Application Date: 2020-11-17
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Publication No.: US12117507B2Publication Date: 2024-10-15
- Inventor: Daizo Endo , Tatsunori Shino , Akira Sakawaki , Sho Tonegawa , Yasumasa Watanabe
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 19239497 2019.12.27
- International Application: PCT/JP2020/042697 2020.11.17
- International Announcement: WO2021/131400A 2021.07.01
- Date entered country: 2022-06-13
- Main IPC: G01R33/06
- IPC: G01R33/06

Abstract:
A magnetic sensor includes: plural sensitive elements 31 each including a soft magnetic material layer 105 having a longitudinal direction and a transverse direction and a conductor layer having higher conductivity than the soft magnetic material layer 105 and extending through the soft magnetic material layer 105 in a longitudinal direction, the sensitive element 31 having uniaxial magnetic anisotropy in a direction intersecting the longitudinal direction and being configured to sense a magnetic field by a magnetic impedance effect; and a connecting portion 32 continuous with the conductor layer of the sensitive element and configured to connect transversely adjacent sensitive elements 31 in series.
Public/Granted literature
- US20230009139A1 MAGNETIC SENSOR AND METHOD FOR MANUFACTURING MAGNETIC SENSOR Public/Granted day:2023-01-12
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