- 专利标题: Mask defect prevention
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申请号: US18359954申请日: 2023-07-27
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公开(公告)号: US12124163B2公开(公告)日: 2024-10-22
- 发明人: Chi-Ta Lu , Chih-Chiang Tu , Cheng-Ming Lin , Ching-Yueh Chen , Wei-Chung Hu , Ting-Chang Hsu , Yu-Tung Chen
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: HAYNES AND BOONE, LLP
- 主分类号: G03F1/24
- IPC分类号: G03F1/24 ; G03F1/36 ; G03F1/38 ; G03F1/54 ; G03F1/64 ; G03F7/20
摘要:
A photolithographic mask assembly according to the present disclosure accompanies a photolithographic mask. The photolithographic mask includes a capping layer over a substrate and an absorber layer disposed over the capping layer. The absorber layer includes a first main feature area, a second main feature area, and a venting feature area disposed between the first main feature area and the second main feature area. The venting feature area includes a plurality of venting features.
公开/授权文献
- US20230367197A1 Mask Defect Prevention 公开/授权日:2023-11-16
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