- 专利标题： Substrate processing apparatus
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申请号： US17667459申请日： 2022-02-08
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公开(公告)号： US12131918B2公开(公告)日： 2024-10-29
- 发明人: Sang Min Lee , Seung Hoon Oh , Yong Joon Im , Hyo Won Yang
- 申请人： SEMES CO., LTD.
- 申请人地址： KR Cheonan-si
- 专利权人： SEMES CO., LTD.
- 当前专利权人： SEMES CO., LTD.
- 当前专利权人地址： KR Cheonan-si
- 优先权： KR 20210040673 2021.03.29
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B08B3/04 ; F26B5/00
摘要：
A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.
公开/授权文献
- US20220305536A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日：2022-09-29
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