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公开(公告)号:US12131918B2
公开(公告)日:2024-10-29
申请号:US17667459
申请日:2022-02-08
Applicant: SEMES CO., LTD.
Inventor: Sang Min Lee , Seung Hoon Oh , Yong Joon Im , Hyo Won Yang
CPC classification number: H01L21/67028 , H01L21/67023 , B08B3/04 , F26B5/005 , H01L21/6719
Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.
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公开(公告)号:US20230201883A1
公开(公告)日:2023-06-29
申请号:US18068869
申请日:2022-12-20
Applicant: SEMES CO., LTD.
Inventor: Yong Hyun Choi , Young Hun Lee , Yong Joon Im , Seung Hoon Oh , Tae Jong Choi , Yong Sun Ko , Sang Min Lee , Jin Woo Jung
CPC classification number: B08B3/022 , H01L21/67173 , H01L21/68707 , B08B13/00 , B25J11/0095 , F26B3/283
Abstract: Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.
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