Invention Grant
- Patent Title: High-frequency component test device and method thereof
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Application No.: US17559371Application Date: 2021-12-22
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Publication No.: US12163989B2Publication Date: 2024-12-10
- Inventor: Sih-Han Li , Jie Zhang , Peng-I Mei
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW110142087 20211111
- Main IPC: G01R27/32
- IPC: G01R27/32 ; G01R35/00

Abstract:
A high-frequency component test device including a test key and a test module is provided. The test key includes a front-level key and a back-level key which are arranged symmetrically and have the same electrical length and characteristic impedance. The test module is used to measure an S parameter of the front-level key and the back-level key connected directly and an S parameter of a structure where a device under test (DUT) is added between the front-level key and the back-level key. The test module performs S parameter calculation in the frequency domain and converts the S parameter into an ABCD parameter matrix, and then obtains an ABCD parameter of a de-embedded DUT using a matrix root-opening operation and an inverse matrix operation.
Public/Granted literature
- US20220341978A1 HIGH-FREQUENCY COMPONENT TEST DEVICE AND METHOD THEREOF Public/Granted day:2022-10-27
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