Invention Grant
- Patent Title: Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips
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Application No.: US17134368Application Date: 2020-12-26
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Publication No.: US12213288B2Publication Date: 2025-01-28
- Inventor: Prabhakar Subrahmanyam , Arun Krishnamoorthy , Victor Polyanko , Ying-Feng Pang , Yi Xia , Pooya Tadayon , Muhammad Ahmad , Rahima K. Mohammed
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.
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