公开(公告)号：US12213288B2

公开(公告)日：2025-01-28

申请号：US17134368

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy ,  Victor Polyanko ,  Ying-Feng Pang ,  Yi Xia ,  Pooya Tadayon ,  Muhammad Ahmad ,  Rahima K. Mohammed

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

公开(公告)号：US11439037B2

公开(公告)日：2022-09-06

申请号：US15986657

申请日：2018-05-22

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy

IPC: H05K7/20 ,  H05K1/02

Abstract: Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.