A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.