公开(公告)号：US20220069540A1

公开(公告)日：2022-03-03

申请号：US17466240

申请日：2021-09-03

申请人： SCHOTT AG

发明人： Ong Wai Li ,  Jian Dean Tan ,  Amy Soon Li Ping ,  Andreas Krause ,  Artit Aowudomsuk ,  Karsten Droegemueller

IPC分类号： H01S5/023 ,  H01S5/02212

摘要： A header for an electronic component is provided. The header includes a base, a pedestal, and a submount. The base has a feedthrough with a feedthrough pin extending through the base and being electrically insulated from the base. The pedestal is connected to the base. The submount is connected to the pedestal. The pedestal is joined to the base via a pedestal substance-to-substance bond.

公开(公告)号：US11256048B2

公开(公告)日：2022-02-22

申请号：US16552669

申请日：2019-08-27

申请人： SCHOTT AG

发明人： Robert Hettler ,  Artit Aowudomsuk ,  Kenneth Tan ,  Karsten Droegemueller

IPC分类号： G02B6/42 ,  H04B10/572 ,  H01S5/02212 ,  H01B17/30

摘要： A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

公开(公告)号：US11088096B2

公开(公告)日：2021-08-10

申请号：US16154989

申请日：2018-10-09

申请人： SCHOTT AG

发明人： Artit Aowudomsuk ,  Karsten Droegemueller ,  Rudolf Jungwirth ,  Michelle YanYan Fang

IPC分类号： H01L23/66 ,  H05K3/34 ,  H05K1/18 ,  H01S5/02212 ,  H05K1/02 ,  H01L23/00

摘要： A transistor outline housing is provided that includes a header for an optoelectronic component. The header has electrical feedthroughs in the form of connection pins embedded in a potting compound. The header has a recess in which at least one of the connection pins in one of the feedthroughs extends out of the lower surface of the header.

公开(公告)号：US20200067265A1

公开(公告)日：2020-02-27

申请号：US16552145

申请日：2019-08-27

申请人： SCHOTT AG

发明人： Robert Hettler ,  Artit Aowudomsuk ,  Kenneth Tan ,  Karsten Droegemueller

IPC分类号： H01S5/022

摘要： A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

公开(公告)号：US09159634B2

公开(公告)日：2015-10-13

申请号：US14158690

申请日：2014-01-17

申请人： Schott AG

发明人： Robert Hettler ,  Kenneth Tan ,  Georg Mittermeier ,  Karsten Droegemueller

IPC分类号： H01L23/48 ,  H01L29/32 ,  H01L23/08 ,  H01L23/66 ,  H01L23/64 ,  H01L23/045 ,  H01L23/31

CPC分类号： H01L23/08 ,  H01L23/045 ,  H01L23/3157 ,  H01L23/64 ,  H01L23/66 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/2065 ,  H01L2924/20649 ,  H01L2924/20645 ,  H01L2924/20644 ,  H01L2924/20643 ,  H01L2224/45099 ,  H01L2924/00

摘要： A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.

摘要翻译： 提供了在上表面具有接合线的晶体管轮廓外壳。 接合线的长度减小，并且在与接合端相对的端部处具有连续引线，其具有多余的长度。

公开(公告)号：US10763638B2

公开(公告)日：2020-09-01

申请号：US16119571

申请日：2018-08-31

申请人： SCHOTT AG

发明人： Rudolf Jungwirth ,  Amy Soon Li Ping ,  Artit Aowudomsuk ,  Ong Wai Li ,  Kenneth Tan ,  Karsten Droegemueller

IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/12 ,  H01S5/062

摘要： A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.

公开(公告)号：US20190109102A1

公开(公告)日：2019-04-11

申请号：US16154989

申请日：2018-10-09

申请人： SCHOTT AG

发明人： Artit Aowudomsuk ,  Karsten Droegemueller ,  Rudolf Jungwirth ,  Michelle YanYan Fang

IPC分类号： H01L23/66 ,  H05K1/02 ,  H01S5/022

摘要： A transistor outline housing is provided that includes a header for an optoelectronic component. The header has electrical feedthroughs in the form of connection pins embedded in a potting compound. The header has a recess in which at least one of the connection pins in one of the feedthroughs extends out of the lower surface of the header.

公开(公告)号：US20140217570A1

公开(公告)日：2014-08-07

申请号：US14158690

申请日：2014-01-17

申请人： SCHOTT AG

发明人： Robert Hettler ,  Kenneth Tan ,  Georg Mittermeyer ,  Karsten Droegemueller

IPC分类号： H01L23/10 ,  H01L23/08 ,  H01L23/66

CPC分类号： H01L23/08 ,  H01L23/045 ,  H01L23/3157 ,  H01L23/64 ,  H01L23/66 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/2065 ,  H01L2924/20649 ,  H01L2924/20645 ,  H01L2924/20644 ,  H01L2924/20643 ,  H01L2224/45099 ,  H01L2924/00

摘要： A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.

摘要翻译： 提供了在上表面具有接合线的晶体管轮廓外壳。 接合线的长度减小，并且在与接合端相对的端部处具有连续引线，其具有多余的长度。

公开(公告)号：US11128101B2

公开(公告)日：2021-09-21

申请号：US16552145

申请日：2019-08-27

申请人： SCHOTT AG

发明人： Robert Hettler ,  Artit Aowudomsuk ,  Kenneth Tan ,  Karsten Droegemueller

IPC分类号： H01S5/22 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235

摘要： A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

公开(公告)号：US20200064572A1

公开(公告)日：2020-02-27

申请号：US16552669

申请日：2019-08-27

申请人： SCHOTT AG

发明人： Robert Hettler ,  Artit Aowudomsuk ,  Kenneth Tan ,  Karsten Droegemueller

IPC分类号： G02B6/42 ,  H04B10/572 ,  H01B17/30 ,  H01S5/022

摘要： A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.