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    MULTI-LASER ARRANGEMENT, IN PARTICULAR AN RGB LASER MODULE DEVICE
    3.
    发明申请
    MULTI-LASER ARRANGEMENT, IN PARTICULAR AN RGB LASER MODULE DEVICE 有权

    公开(公告)号：US20210328412A1

    公开(公告)日：2021-10-21

    申请号：US17235582

    申请日：2021-04-20

    Applicant: SCHOTT AG

    Inventor： Robert Hettler ,  Amy Soon Li Ping ,  Ong Wai Li ,  Artit Aowudomsuk

    IPC: H01S5/40 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02253 ,  H01S5/02251 ,  H01S5/00

    Abstract: A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.

    Header for an electric component
    4.
    发明授权
    Header for an electric component 有权

    公开(公告)号：US12230937B2

    公开(公告)日：2025-02-18

    申请号：US17461663

    申请日：2021-08-30

    Applicant: SCHOTT AG

    Inventor： Ong Wai Li ,  Jian Dean Tan ,  Amy Soon Li Ping ,  Andreas Krause ,  Artit Aowudomsuk ,  Karsten Droegemueller

    IPC: H01S5/02212 ,  H01S5/02345 ,  H01S5/024

    Abstract: A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.

    CONDUCTOR TRACK ARRANGEMENT FOR HIGH-FREQUENCY SIGNALS, BASE AND ELECTRONIC COMPONENT HAVING A CONDUCTOR TRACK ARRANGEMENT
    7.
    发明申请
    CONDUCTOR TRACK ARRANGEMENT FOR HIGH-FREQUENCY SIGNALS, BASE AND ELECTRONIC COMPONENT HAVING A CONDUCTOR TRACK ARRANGEMENT 有权

    公开(公告)号：US20230097003A1

    公开(公告)日：2023-03-30

    申请号：US17936349

    申请日：2022-09-28

    Applicant: SCHOTT AG

    Inventor： Karsten Droegemüller ,  Ong Wai Li ,  Yin Cheng Wong ,  Amy Soon ,  Artit Aowudomsuk

    IPC: H01P3/08 ,  H01P5/02

    Abstract: A conductor track arrangement for high-frequency signals is provided. The arrangement includes a carrier, a ground conductor, and a pair of signal conductors. The signal conductors are layered and are arranged on the carrier opposite the ground conductor. A distance is between the signal conductors, which have a deflection region, in which a direction of the signal conductors changes. The deflection region has a reduced distance, which is reduced compared to the distance d between the signal conductors outside the deflection region. The distance between the signal conductors in transition regions from straight portions of the signal conductors into the deflection region is reduced here symmetrically with respect to an extension of a centre line between the two signal conductors into their respective straight portions and/or a capacitor is introduced into the signal conductor considered to be the inner signal conductor in respect of the direction change.

    HEADER AND PACKAGE WITH INTEGRATED COOLER FOR ELECTRONIC COMPONENTS
    8.
    发明申请
    HEADER AND PACKAGE WITH INTEGRATED COOLER FOR ELECTRONIC COMPONENTS 有权

    公开(公告)号：US20210281042A1

    公开(公告)日：2021-09-09

    申请号：US17190860

    申请日：2021-03-03

    Applicant: SCHOTT AG

    Inventor： Andreas Krause ,  Amy Soon Li Ping ,  Ong Wai Li ,  Karsten Droegemüller ,  Artit Aowudomsuk

    IPC: H01S5/02315 ,  H05K1/02 ,  H05K1/14 ,  H01S5/024

    Abstract: A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.

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