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    MULTI-LASER ARRANGEMENT, IN PARTICULAR AN RGB LASER MODULE DEVICE
    4.
    发明申请
    MULTI-LASER ARRANGEMENT, IN PARTICULAR AN RGB LASER MODULE DEVICE 有权

    公开(公告)号：US20210328412A1

    公开(公告)日：2021-10-21

    申请号：US17235582

    申请日：2021-04-20

    申请人： SCHOTT AG

    发明人： Robert Hettler ,  Amy Soon Li Ping ,  Ong Wai Li ,  Artit Aowudomsuk

    IPC分类号： H01S5/40 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02253 ,  H01S5/02251 ,  H01S5/00

    摘要： A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.

    HEADER AND PACKAGE WITH INTEGRATED COOLER FOR ELECTRONIC COMPONENTS
    7.
    发明申请
    HEADER AND PACKAGE WITH INTEGRATED COOLER FOR ELECTRONIC COMPONENTS 有权

    公开(公告)号：US20210281042A1

    公开(公告)日：2021-09-09

    申请号：US17190860

    申请日：2021-03-03

    申请人： SCHOTT AG

    发明人： Andreas Krause ,  Amy Soon Li Ping ,  Ong Wai Li ,  Karsten Droegemüller ,  Artit Aowudomsuk

    IPC分类号： H01S5/02315 ,  H05K1/02 ,  H05K1/14 ,  H01S5/024

    摘要： A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.