Invention Application
- Patent Title: OPTICAL MONITORING IN A TWO-STEP CHEMICAL MECHANICAL POLISHING PROCESS
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Application No.: US10339959Application Date: 2003-01-10
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Publication No.: US20030104760A1Publication Date: 2003-06-05
- Inventor: Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
- Applicant: Applied Materials, Inc. a Delaware corporation
- Applicant Address: null
- Assignee: Applied Materials, Inc. a Delaware corporation
- Current Assignee: Applied Materials, Inc. a Delaware corporation
- Current Assignee Address: null
- Main IPC: B24B049/00
- IPC: B24B049/00
Abstract:
An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
Public/Granted literature
- US06632124B2 Optical monitoring in a two-step chemical mechanical polishing process Public/Granted day:2003-10-14
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