公开(公告)号：US20030190867A1

公开(公告)日：2003-10-09

申请号：US10405421

申请日：2003-04-01

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Manoocher Birang ,  Allan Gleason ,  William L. Guthrie

IPC分类号： B24B049/12

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  B24D18/00 ,  G01B11/06 ,  G01B11/0683

摘要： The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.

摘要翻译： 用于化学机械抛光装置的抛光垫及其制造方法。 抛光垫具有与抛光表面相邻的覆盖层和与压板相邻的背衬层。 具有第一横截面积的覆盖层中的第一开口和具有第二不同横截面积的背衬层中的第二开口形成穿过抛光垫的孔。 基本上透明的聚氨酯塞被定位在孔中，并且粘合剂材料将塞子固定在孔中。

公开(公告)号：US20040106357A1

公开(公告)日：2004-06-03

申请号：US10722305

申请日：2003-11-25

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Manoocher Birang ,  Allan Glenson

IPC分类号： B24B049/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683 ,  Y10T428/15 ,  Y10T428/162 ,  Y10T428/163 ,  Y10T428/17 ,  Y10T428/218 ,  Y10T428/234 ,  Y10T428/24273 ,  Y10T428/24281 ,  Y10T428/24289 ,  Y10T428/24322 ,  Y10T428/24364 ,  Y10T428/24479 ,  Y10T428/249978 ,  Y10T428/31

摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

摘要翻译： 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US20030104760A1

公开(公告)日：2003-06-05

申请号：US10339959

申请日：2003-01-10

申请人： Applied Materials, Inc. a Delaware corporation

发明人： Bret W. Adams ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Savitha Nanjangud ,  Andreas Norbert Wiswesser ,  Stan D. Tsai ,  David A. Chan ,  Fred C. Redeker ,  Manoocher Birang

IPC分类号： B24B049/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  B24B49/12 ,  H01L21/30625

摘要： An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

公开(公告)号：US20020072313A1

公开(公告)日：2002-06-13

申请号：US10059519

申请日：2002-01-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B005/00

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

公开(公告)号：US20040014395A1

公开(公告)日：2004-01-22

申请号：US10397633

申请日：2003-03-25

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC分类号： B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC分类号： B24B47/12 ,  B24B37/013 ,  B24B37/205 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

摘要翻译： 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US20030181137A1

公开(公告)日：2003-09-25

申请号：US10394599

申请日：2003-03-21

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Fred C. Redeker ,  Manoocher Birang ,  Shijian Li ,  Sasson Somekh

IPC分类号： B24B049/00

CPC分类号： B24B37/005 ,  B24B21/04 ,  B24B49/04 ,  B24B49/12 ,  H01L21/30625

摘要： A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.

摘要翻译： 用于化学机械抛光的抛光制品。 抛光制品包括具有抛光表面的大致细长的抛光片。 抛光制品由基本上不透明的材料形成，并且具有基本上延伸至少半透明的抛光片的长度的离散区域。

公开(公告)号：US20040033769A1

公开(公告)日：2004-02-19

申请号：US10353326

申请日：2003-01-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B005/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

摘要翻译： 用于化学机械抛光装置的载体头。 承载头包括壳体，基座，装载机构，万向节机构和基底背衬组件。 衬底背衬组件包括位于底座下方的支撑结构，将支撑结构连接到基座的基本水平的环形弯曲部，以及连接到支撑结构的柔性膜。 柔性膜具有用于基底的安装表面，并且在基底之下延伸以限定腔室。

公开(公告)号：US20020086624A1

公开(公告)日：2002-07-04

申请号：US10071745

申请日：2002-02-08

申请人： Applied Materials, Inc. a Delaware corporation

发明人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B001/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.