专利检索 ap:("Applied Materials, Inc. a Delaware corporation") AND inv:"Savitha Nanjangud" 第 1 页

1.

发明申请
OPTICAL MONITORING IN A TWO-STEP CHEMICAL MECHANICAL POLISHING PROCESS 失效

公开(公告)号：US20030104760A1

公开(公告)日：2003-06-05

申请号：US10339959

申请日：2003-01-10

申请人： Applied Materials, Inc. a Delaware corporation

发明人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang

IPC分类号： B24B049/00

CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625

摘要： An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.