发明申请
US20050029676A1 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
有权
焊接掩模包括用于至少部分地围绕载体基板的端子和与坝相邻定位的凹陷区域的坝，以及包括这种焊接掩模的载体基板
- 专利标题： Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
- 专利标题（中）： 焊接掩模包括用于至少部分地围绕载体基板的端子和与坝相邻定位的凹陷区域的坝，以及包括这种焊接掩模的载体基板
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申请号： US10936304申请日： 2004-09-07
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公开(公告)号： US20050029676A1公开(公告)日： 2005-02-10
- 发明人: Cher Tan , Choon Lee , Kian Lee , Guek Lim , Wuu Tay , Teck Poh , Cheng Pour
- 申请人： Cher Tan , Choon Lee , Kian Lee , Guek Lim , Wuu Tay , Teck Poh , Cheng Pour
- 优先权： SG200201827-3 20020204
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L23/13 ; H01L23/16 ; H01L23/31 ; H01L23/538 ; H05K3/30 ; H05K3/34 ; H01L23/34
摘要：
A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
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