公开(公告)号：US20050029676A1

公开(公告)日：2005-02-10

申请号：US10936304

申请日：2004-09-07

申请人： Cher Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Pour

发明人： Cher Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Pour

IPC分类号： H01L21/58 ,  H01L23/13 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H05K3/30 ,  H05K3/34 ,  H01L23/34

CPC分类号： H01L24/83 ,  B33Y80/00 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/538 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10689 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.

摘要翻译： 用于载体衬底的焊接掩模包括可位于载体衬底的管芯支撑位置的至少一部分上的器件固定区域。 焊料掩模的大坝位于横向邻近于载体衬底的相应端子的周边的至少一部分。 载体基板包括至少一个管芯附着位置和从载体衬底的表面突出的一个或多个端子，以防止粘合剂材料污染其连接表面。 焊接掩模可以定位或形成在载体基板上。 载体衬底和焊料掩模可以各自包括一个或多个凹陷区域，其分别横向包围其管芯附接位置和器件固定区域的至少一部分，以容纳多余的粘合剂。

公开(公告)号：US20050287702A1

公开(公告)日：2005-12-29

申请号：US11215628

申请日：2005-08-29

申请人： Cher Victor Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Poh

发明人： Cher Victor Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Poh

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/13 ,  H01L23/498 ,  H05K3/30

CPC分类号： H01L24/97 ,  B33Y80/00 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.

摘要翻译： 一种用于设计载体基板的方法包括：配置至少一个管芯附着位置和从载体衬底的表面突出的一个或多个端子，以防止粘合剂材料污染其连接表面。 该方法还可以包括配置载体衬底以包括一个或多个凹陷区域，该凹陷区域横向围绕裸片附接位置的至少一部分以接收多余的粘合剂。

公开(公告)号：US08654673B2

公开(公告)日：2014-02-18

申请号：US13025545

申请日：2011-02-11

申请人： Gaurish R Dalvi ,  Choon Lee ,  Ashish Ranjan

发明人： Gaurish R Dalvi ,  Choon Lee ,  Ashish Ranjan

IPC分类号： H04L12/56

CPC分类号： H04L41/0813 ,  H04L12/462 ,  H04L12/4641 ,  H04L45/48 ,  H04L45/54

摘要： A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

摘要翻译： 方法可以包括：接收对第一虚拟局域网（VLAN）/生成树表的重新配置，其中第一VLAN /生成树表具有第一标识符并且与网络的区域相关联; 基于重新配置，更新第一个VLAN /生成树表以生成第二个VLAN /生成树表; 确定第二VLAN /生成树表的第二标识符; 以及生成与所述网络的所述区域相关联的标识符的列表，所述列表包括所述第一标识符和所述第二标识符。

公开(公告)号：US20070155048A1

公开(公告)日：2007-07-05

申请号：US11412633

申请日：2006-04-26

申请人： Choon Lee ,  Chin Chong ,  David Corisis

发明人： Choon Lee ,  Chin Chong ,  David Corisis

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L25/105 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/08235 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2224/81

摘要： Methods for packaging microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One aspect of the invention is directed toward a method for packaging a microelectronic device that includes coupling an active side of a microelectronic die to a surface of a support member. The microelectronic die can have a backside opposite the active side, a peripheral side extending at least part way between the active side and the backside, and at least one through-wafer interconnect. The method can further include applying an encapsulant to cover a portion of the surface of the support member so that a portion of the encapsulant is laterally adjacent to the peripheral side, removing material from a backside of the microelectronic die to expose a portion of at least one through-wafer interconnect, and applying a redistribution structure to the backside of the microelectronic die.

摘要翻译： 本文公开了使用这种方法形成的微电子器件和微电子器件的封装方法。 本发明的一个方面涉及一种用于封装微电子器件的方法，该方法包括将微电子管芯的有效侧耦合到支撑构件的表面。 微电子管芯可以具有与有源侧相反的背面，在有源侧和背面之间至少部分延伸的外围侧和至少一个贯通晶片互连。 该方法还可以包括施加密封剂以覆盖支撑构件的表面的一部分，使得密封剂的一部分横向邻近周边侧，从微电子管芯的背面去除材料以暴露至少一部分 一个晶片间互连，并将再分布结构施加到微电子管芯的背面。

公开(公告)号：US20060092080A1

公开(公告)日：2006-05-04

申请号：US11254432

申请日：2005-10-20

申请人： Choon Lee

发明人： Choon Lee

IPC分类号： H01Q1/38

CPC分类号： H01Q9/0471

摘要： A wireless communication device includes an antenna configured with two conductive elements separated by an insulating medium. One conductive element is a ground plane and the other is a microstrip line. The ground plane is formed with a bend proximate an end. The microstrip line and the ground plane exhibit a characteristic impedance that may vary along the length of the microstrip line. The separation distance of the microstrip line from the ground plane is changed to reduce the resonant frequency of the microstrip line. A second microstrip line with an open end and another end shorted to the ground plane is operative to prevent RF current from flowing on the backside of the ground plane. A backside of the ground plane and the second microstrip line may be covered with a lossy magnetic medium to reduce the near field above the backside of the ground plane.

摘要翻译： 无线通信设备包括配置有由绝缘介质隔开的两个导电元件的天线。 一个导电元件是接地平面，另一个是微带线。 接地平面靠近端部形成弯曲。 微带线和接地平面呈现出沿着微带线的长度可能变化的特征阻抗。 改变微带线与接地面的间隔距离，以减小微带线的谐振频率。 具有开放端和与接地面短路的另一端的第二微带线可操作以防止RF电流在接地平面的背面流动。 接地平面和第二微带线的背面可以用有损磁介质覆盖，以减少接地平面后面的近场。

公开(公告)号：US20050056566A1

公开(公告)日：2005-03-17

申请号：US10901535

申请日：2004-07-29

申请人： Choon Lee

发明人： Choon Lee

IPC分类号： A45C11/00 ,  B65D83/00 ,  B65D69/00

CPC分类号： A45C11/008 ,  B65D83/005 ,  Y10S206/804 ,  Y10S206/817

摘要： A cosmetic brush container has a cylindrical sidewall, a closed bottom, and an open top. A tray is carried within the container for axial movement relative to a longitudinal axis of the container from a lower storage position. A lid releasably fits over the top of the container. A rod extends between the tray and the lid. Brushes are carried in the container, with lower ends supported on the tray and bristles supported by the sidewall of the container. Lifting the lid causes the tray to move upward and the bristles of the brushes to move above the top of the container for access by a user.

摘要翻译： 化妆刷容器具有圆柱形侧壁，封闭底部和敞开的顶部。 在容器内承载托盘，用于相对于容器的纵向轴线从下部存储位置轴向移动。 盖可拆卸地装配在容器的顶部上。 杆在托盘和盖子之间延伸。 刷子装在容器中，下端支撑在托盘上，刷毛由容器的侧壁支撑。 提起盖子使得托盘向上移动并且刷子的刷毛在容器的顶部上方移动以供用户访问。

公开(公告)号：US20050037154A1

公开(公告)日：2005-02-17

申请号：US10495157

申请日：2002-11-08

申请人： Won Koh ,  Choon Lee

发明人： Won Koh ,  Choon Lee

IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/515 ,  H01L21/205 ,  H01L21/285 ,  H01L21/316 ,  H05H1/24

CPC分类号： C23C16/515 ,  C23C16/45531 ,  C23C16/45536 ,  C23C16/45542

摘要： Method for forming a thin film at low temperature by using plasma pulses is disclosed. While a purge gas or a reactant purge gas activated by plasma is continuously supplied into a reactor, a source gas is supplied intermittently into the reactor during which period plasma is generated in the reactor so that the source gas and the purge gas activated by plasma reacts, so that a thin film is formed according to the method. Also, a method for forming a thin layer of film containing a plural of metallic elements, a method for forming a thin metallic film containing varied contents by amount of the metallic elements by using a supercycle Tsupercycle comprising a combination of simple gas supply cycles Tcycle, . . . , and a method for forming a thin film containing continuously varying compositions of the constituent elements by using a supercycle Tsupercycle comprising a combination of simple gas supply cycles Tcycle, . . . , are disclosed. The methods for forming thin films disclosed here allows to shorten the purge cycle duration even if the reactivity between the source gases is high, to reduce the contaminants caused by the gas remaining in the reactor, to form a thin film at low temperature even if the reactivity between the source gases is low, and also to increase the rate of thin film formation.

摘要翻译： 公开了通过使用等离子体脉冲在低温下形成薄膜的方法。 当将等离子体激活的净化气体或反应物吹扫气体连续地供应到反应器中时，将源气体间歇地供给到反应器中，在此期间在反应器中产生等离子体，使得由等离子体激活的源气体和净化气体反应 ，从而根据该方法形成薄膜。 另外，用于形成含有多种金属元素的薄膜的方法，通过使用包含简单气体供给循环Tcycle的组合的超级循环多孔来形成含有金属元素量的不同含量的金属薄膜的方法， 。 。 。 以及通过使用包含简单气体供应循环Tcycle的组合的超级循环多孔循环形成含有连续变化的组成元素组成的薄膜的方法。 。 。 ，被披露。 这里公开的形成薄膜的方法允许缩短净化循环持续时间，即使源气体之间的反应性高，以减少由残留在反应器中的气体引起的污染物，以在低温下形成薄膜，即使 源气体之间的反应性低，并且也增加了薄膜形成速率。

公开(公告)号：US06714253B2

公开(公告)日：2004-03-30

申请号：US09799077

申请日：2001-03-06

申请人： Eun Joo Kim ,  Choon Lee ,  Teag Il Cho

发明人： Eun Joo Kim ,  Choon Lee ,  Teag Il Cho

IPC分类号： H04N546

CPC分类号： H04N7/0122 ,  H04N5/4401 ,  H04N21/43632 ,  H04N21/440218 ,  H04N21/440272 ,  H04N21/44231 ,  H04N21/4621

摘要： A method of displaying a digital broadcasting signal using a digital broadcasting receiver and a digital display device is disclosed. In the present invention, information on a display mode of the display device is communicated to the digital broadcasting receiver through a bi-directional communication line. As a result, the digital broadcasting receiver can process the input digital broadcasting signal according to the display mode. Thus, the digital broadcasting signal can be displayed in an optimum display mode through the digital display device. Accordingly, the received digital broadcasting signal can be displayed in diverse formats and in an optimum condition.

摘要翻译： 公开了使用数字广播接收机和数字显示装置显示数字广播信号的方法。 在本发明中，通过双向通信线路将显示装置的显示模式的信息传送给数字广播接收机。 结果，数字广播接收机可以根据显示模式处理输入的数字广播信号。 因此，可以通过数字显示装置以最佳显示模式显示数字广播信号。 因此，所接收的数字广播信号可以以各种格式和最佳状态显示。

公开(公告)号：US20110134803A1

公开(公告)日：2011-06-09

申请号：US13025545

申请日：2011-02-11

申请人： Gaurish R. DALVI ,  Choon Lee ,  Ashish Ranjan

发明人： Gaurish R. DALVI ,  Choon Lee ,  Ashish Ranjan

IPC分类号： H04L12/28

CPC分类号： H04L41/0813 ,  H04L12/462 ,  H04L12/4641 ,  H04L45/48 ,  H04L45/54

摘要： A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

摘要翻译： 方法可以包括：接收对第一虚拟局域网（VLAN）/生成树表的重新配置，其中第一VLAN /生成树表具有第一标识符并且与网络的区域相关联; 基于重新配置，更新第一个VLAN /生成树表以生成第二个VLAN /生成树表; 确定第二VLAN /生成树表的第二标识符; 以及生成与所述网络的所述区域相关联的标识符的列表，所述列表包括所述第一标识符和所述第二标识符。

公开(公告)号：US20080099931A1

公开(公告)日：2008-05-01

申请号：US11969300

申请日：2008-01-04

申请人： Chin Chong ,  Choon Lee ,  David Corisis

发明人： Chin Chong ,  Choon Lee ,  David Corisis

IPC分类号： H01L23/49 ,  H05K1/11

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.

摘要翻译： 用于安装微电子管芯的基板，在这种基板中形成通孔的方法，以及用于封装微电子器件的方法。 根据本发明的一个实施例的制造基板的方法包括在非导电材料片的第一侧上形成导电迹线，并且从片材的第二面通过非导电材料形成通孔， 导电迹线。 该方法还包括去除非导电材料的一部分以形成穿过通孔的至少一部分延伸的非导电材料的边缘。 在一个实施例中，跨过通孔形成边缘暴露出第二导电迹线的至少一部分，以便随后连接到微电子管芯上的端子。