公开(公告)号：US20050029676A1

公开(公告)日：2005-02-10

申请号：US10936304

申请日：2004-09-07

申请人： Cher Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Pour

发明人： Cher Tan ,  Choon Lee ,  Kian Lee ,  Guek Lim ,  Wuu Tay ,  Teck Poh ,  Cheng Pour

IPC分类号： H01L21/58 ,  H01L23/13 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H05K3/30 ,  H05K3/34 ,  H01L23/34

CPC分类号： H01L24/83 ,  B33Y80/00 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/538 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10689 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.

摘要翻译： 用于载体衬底的焊接掩模包括可位于载体衬底的管芯支撑位置的至少一部分上的器件固定区域。 焊料掩模的大坝位于横向邻近于载体衬底的相应端子的周边的至少一部分。 载体基板包括至少一个管芯附着位置和从载体衬底的表面突出的一个或多个端子，以防止粘合剂材料污染其连接表面。 焊接掩模可以定位或形成在载体基板上。 载体衬底和焊料掩模可以各自包括一个或多个凹陷区域，其分别横向包围其管芯附接位置和器件固定区域的至少一部分，以容纳多余的粘合剂。

公开(公告)号：US20070231964A1

公开(公告)日：2007-10-04

申请号：US11760458

申请日：2007-06-08

申请人： Teck Lee ,  Cher Tan

发明人： Teck Lee ,  Cher Tan

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K2201/0394 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in electrical communication with a semiconductor die attached to the first surface. Interconnect recesses accessible on the opposite second surface expose one or more conductive traces. A conductive element, such as a solder ball, disposed substantially within the interconnect recess allows the assembly to be mounted on a substrate or a similar assembly. By substantially containing the conductive element within the interconnect recess, the height of the completed assembly is reduced. Assemblies may be stacked to form multidie assemblies. Interconnect structures, such as connection pads, or enlarged traces upon the first surface are employed to connect stacked assemblies.

摘要翻译： 与半导体组件相关的装置和方法。 半导体组件包括可由诸如聚酰亚胺胶带的柔性材料构成的插入件。 布置在插入件的第一表面上的导电迹线的图案与附接到第一表面的半导体管芯电连通。 在相对的第二表面上可接近的互连凹部暴露一个或多个导电迹线。 基本上设置在互连凹槽内的诸如焊球的导电元件允许组件安装在基板或类似组件上。 通过在互连凹槽内基本上包含导电元件，完成组件的高度减小。 组件可以堆叠形成多组件。 互连结构，例如连接焊盘或第一表面上的放大迹线被用于连接堆叠的组件。

公开(公告)号：US20050029550A1

公开(公告)日：2005-02-10

申请号：US10933060

申请日：2004-09-01

申请人： Teck Lee ,  Cher Tan

发明人： Teck Lee ,  Cher Tan

IPC分类号： H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H05K3/34 ,  H01L27/10

CPC分类号： H05K3/3436 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K2201/0394 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in electrical communication with a semiconductor die attached to the first surface. Interconnect recesses accessible on the opposite second surface expose one or more conductive traces. A conductive element, such as a solder ball, disposed substantially within the interconnect recess allows the assembly to be mounted on a substrate or a similar assembly. By substantially containing the conductive element within the interconnect recess, the height of the completed assembly is reduced. Assemblies may be stacked to form multidie assemblies. Interconnect structures, such as connection pads, or enlarged traces upon the first surface are employed to connect stacked assemblies.

摘要翻译： 与半导体组件相关的装置和方法。 半导体组件包括可由诸如聚酰亚胺胶带的柔性材料构成的插入件。 布置在插入件的第一表面上的导电迹线的图案与附接到第一表面的半导体管芯电连通。 在相对的第二表面上可接近的互连凹部暴露一个或多个导电迹线。 基本上布置在互连凹槽内的诸如焊球的导电元件允许组件安装在基板或类似组件上。 通过在互连凹槽内基本上包含导电元件，完成组件的高度减小。 组件可以堆叠形成多组件。 互连结构，例如连接焊盘或第一表面上的放大迹线被用于连接堆叠的组件。