Invention Application
US20050034995A1 Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer
审中-公开
在基体上制造结构化金属层的方法，以及具有结构化金属层的基体
- Patent Title: Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer
- Patent Title (中): 在基体上制造结构化金属层的方法，以及具有结构化金属层的基体
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Application No.: US10917554Application Date: 2004-08-12
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Publication No.: US20050034995A1Publication Date: 2005-02-17
- Inventor: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
- Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Priority: DE10145749.9 20010917
- Main IPC: H05K3/04
- IPC: H05K3/04 ; H05K3/10 ; C25D3/00
Abstract:
Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
Information query
