A binder composition suitable for electronic parts applications and adapted for lamination treatments, which has particularly superior storage stability and adhesive strength as well as a high elastic modulus even at high temperatures, and an adhesive film using the same. More concretely, a binder composition for lamination to be used for such as adhesion of copper foil onto a glass fiber reinforced epoxy resin substrate, characterized by containing a carbodiimide resin (a) and a high molecular weight epoxy resin (b) having average molecular weight of not lower than 500, and the ratio of the components being 30 to 200 parts by weight of (b) based on 100 parts by weight of (a), as well as an adhesive film using the same, and the like.