- 专利标题: Integrated spin valve head
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申请号: US11012001申请日: 2004-12-14
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公开(公告)号: US20050094326A1公开(公告)日: 2005-05-05
- 发明人: Kochan Ju , Cheng Horng , Youfeng Zheng , Simon Liao , Jei-Wei Chang
- 申请人: Kochan Ju , Cheng Horng , Youfeng Zheng , Simon Liao , Jei-Wei Chang
- 专利权人: HEADWAY TECHNOLOGIES, INC.
- 当前专利权人: HEADWAY TECHNOLOGIES, INC.
- 主分类号: G01R33/09
- IPC分类号: G01R33/09 ; B05D7/00 ; G11B5/127 ; G11B5/187 ; G11B5/29 ; G11B5/31 ; G11B5/33 ; G11B5/39 ; H01F10/16 ; H01F10/30 ; H01F10/32 ; H01L43/08 ; H01L43/12 ; H04R31/00
摘要:
Currently, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by inserting a high permeability, high resistivity, thin film shield on the top or bottom (or both) sides of the spin valve sensor. A permeability greater than about 500 is required together with a resistivity about 5 times greater than that of the free layer and an MrT value for the thin film shield that is 4 times greater than that of the free layer. Five embodiments of the invention are described.
公开/授权文献
- US07074456B2 Process for manufacturing a bottom spin valve structure 公开/授权日:2006-07-11
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