发明申请
- 专利标题： Method of forming a conductive via plug
- 专利标题（中）： 形成导电通孔的方法
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申请号： US10819137申请日： 2004-04-07
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公开(公告)号： US20050142871A1公开(公告)日： 2005-06-30
- 发明人: Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
- 申请人： Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
- 优先权： TW92137214 20031226
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L21/288 ; H01L21/336 ; H01L21/44 ; H01L21/4763 ; H01L21/768 ; H01L29/417 ; H01L29/45 ; H05K3/00 ; H05K3/32 ; H05K3/40
摘要：
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
公开/授权文献
- US07358184B2 Method of forming a conductive via plug 公开/授权日：2008-04-15
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