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公开(公告)号：US07358184B2
公开(公告)日：2008-04-15
申请号：US10819137
申请日：2004-04-07
申请人： Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
发明人： Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
IPC分类号： H01L21/44
CPC分类号： H01L29/66742 , H01L21/288 , H01L21/76802 , H01L21/76838 , H01L29/41733 , H01L29/458 , H01L29/66765 , H05K3/002 , H05K3/4069 , H05K2203/013 , H05K2203/0783
摘要： A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
摘要翻译： 公开了形成导电通孔的方法。 导电通孔插塞是通过用喷墨法印刷包含具有绝缘材料溶剂的溶剂的溶液和导电材料而形成的。 所形成的导电通孔塞具有低电阻率，因此可以用作两个分开的导电层之间的电连接。 导电通孔插头的这种制造方法可以实现同时沉积，图案化和蚀刻目的，这显着简化了制造工艺。
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公开(公告)号：US20050142871A1
公开(公告)日：2005-06-30
申请号：US10819137
申请日：2004-04-07
申请人： Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
发明人： Chien-Hung Liu , Ming-Huan Yang , Jane Chang , Chun-Jung Chen , Chao-Kai Cheng , Kou-Chen Liu
IPC分类号： H01L21/20 , H01L21/288 , H01L21/336 , H01L21/44 , H01L21/4763 , H01L21/768 , H01L29/417 , H01L29/45 , H05K3/00 , H05K3/32 , H05K3/40
CPC分类号： H01L29/66742 , H01L21/288 , H01L21/76802 , H01L21/76838 , H01L29/41733 , H01L29/458 , H01L29/66765 , H05K3/002 , H05K3/4069 , H05K2203/013 , H05K2203/0783
摘要： A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
摘要翻译： 公开了形成导电通孔的方法。 导电通孔插塞是通过用喷墨法印刷包含具有绝缘材料溶剂的溶剂的溶液和导电材料而形成的。 所形成的导电通孔塞具有低电阻率，因此可以用作两个分开的导电层之间的电连接。 导电通孔插头的这种制造方法可以实现同时沉积，图案化和蚀刻目的，这显着简化了制造工艺。
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公开(公告)号：US20050136337A1
公开(公告)日：2005-06-23
申请号：US10833209
申请日：2004-04-26
申请人： Yung-Hsiang Wu , Je-Ping Hu , Ming-Huan Yang , Chun-Jung Chen , Chien-Hung Liu
发明人： Yung-Hsiang Wu , Je-Ping Hu , Ming-Huan Yang , Chun-Jung Chen , Chien-Hung Liu
IPC分类号： G03F1/08 , G03F7/00 , G03F9/00 , H01L21/027
摘要： A method for forming wires of nano-meter grade, wherein by printing or dispensing a solution on a substrate, the solute contained in the solution will form two regions with different thicknesses on the substrate when the solvent has dried. After an etching process is comprehensively applied on the substrate, the region with thinner solute will be completely removed, and only the region with the thicker solute remains as the desired wires. With such a process, the line width of the created wires is narrowed to reach the nano-grade.
摘要翻译： 一种用于形成纳米级线的方法，其中通过在基底上印刷或分配溶液，当溶剂干燥时，溶液中所含的溶质将在基底上形成具有不同厚度的两个区域。 在基板上全面应用蚀刻工艺之后，将完全去除具有较薄溶质的区域，只有具有较厚溶质的区域保持为所需的导线。 通过这样的处理，所产生的线的线宽变窄，达到纳米级。
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公开(公告)号：US20060272147A1
公开(公告)日：2006-12-07
申请号：US11505647
申请日：2006-08-17
IPC分类号： B41J2/205
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1601 , B41J2/1639 , B41J2202/13 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099 , Y10T29/49117 , Y10T29/49155 , Y10T29/49346 , Y10T29/49401
摘要： A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
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公开(公告)号：US20050104935A1
公开(公告)日：2005-05-19
申请号：US10860240
申请日：2004-06-03
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1601 , B41J2/1639 , B41J2202/13 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099 , Y10T29/49117 , Y10T29/49155 , Y10T29/49346 , Y10T29/49401
摘要： A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
摘要翻译： 公开了一种喷墨头芯片的结构及其制造方法。 由于需要制造薄的绝缘体层以降低喷墨头芯片的工作功率，我们分别制造钝化层和第二导电层。 钝化层和第二导电层必须由不同的材料形成。 用于钝化层和第二导电层的限定装置具有高选择性，并且不会破坏或损坏喷墨头芯片的结构。
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6.发明授权Metal oxide semiconductor field effect transistors (MOSFETS) used in ink-jet head chips and method for making the same 有权用于喷墨头芯片的金属氧化物半导体场效应晶体管（MOSFET）及其制造方法公开(公告)号：US06841830B2
公开(公告)日：2005-01-11
申请号：US10627637
申请日：2003-07-28
申请人： Chien-Hung Liu , Jian-Chiun Liou , Chun-Jung Chen , Je-Ping Hu
发明人： Chien-Hung Liu , Jian-Chiun Liou , Chun-Jung Chen , Je-Ping Hu
CPC分类号： H01L29/78 , B41J2/14129 , B41J2002/14387 , B41J2202/13 , H01L21/324 , H01L27/0629
摘要： A MOSFET and the method for fabricating them are disclosed to make the inkjet head chips. The MOSFET has the scaled-down junction formation for the source and drain. Using a lower temperature process and interlayer dielectric, the source and drain dopants can not be diffused deeply due to high-temperature driver-in. The contact holes of the drain are provided with plugs of refractory material to avoid spiking between the metal and silicon. This achieves the requirement of high-density devices on the print head chip.
摘要翻译： 公开了一种MOSFET及其制造方法，以制造喷墨头芯片。 MOSFET具有用于源极和漏极的按比例缩小的结形成。 使用较低温度工艺和层间电介质，源极和漏极掺杂物由于高温驱动而不能深入扩散。 漏斗的接触孔设置有耐火材料塞，以避免金属和硅之间的尖峰。 这实现了打印头芯片上高密度设备的要求。
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公开(公告)号：US07527360B2
公开(公告)日：2009-05-05
申请号：US11505647
申请日：2006-08-17
IPC分类号： B41J2/05
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1601 , B41J2/1639 , B41J2202/13 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099 , Y10T29/49117 , Y10T29/49155 , Y10T29/49346 , Y10T29/49401
摘要： A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
摘要翻译： 公开了一种喷墨头芯片的结构及其制造方法。 由于需要制造薄的绝缘体层以降低喷墨头芯片的工作功率，我们分别制造钝化层和第二导电层。 钝化层和第二导电层必须由不同的材料形成。 用于钝化层和第二导电层的限定装置具有高选择性，并且不会破坏或损坏喷墨头芯片的结构。
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公开(公告)号：US07134187B2
公开(公告)日：2006-11-14
申请号：US10860240
申请日：2004-06-03
IPC分类号： H05B3/00
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1601 , B41J2/1639 , B41J2202/13 , Y10T29/49083 , Y10T29/49085 , Y10T29/49099 , Y10T29/49117 , Y10T29/49155 , Y10T29/49346 , Y10T29/49401
摘要： A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
摘要翻译： 公开了一种喷墨头芯片的结构及其制造方法。 由于需要制造薄的绝缘体层以降低喷墨头芯片的工作功率，我们分别制造钝化层和第二导电层。 钝化层和第二导电层必须由不同的材料形成。 用于钝化层和第二导电层的限定装置具有高选择性，并且不会破坏或损坏喷墨头芯片的结构。
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公开(公告)号：US20050045582A1
公开(公告)日：2005-03-03
申请号：US10702555
申请日：2003-11-07
申请人： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
发明人： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
CPC分类号： B41J2/16 , B41J2/1625 , B41J2/1626 , B41J2/1631 , B41J2/1639 , H05K3/0023 , H05K3/205 , H05K2201/09063 , H05K2201/0969
摘要： A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
摘要翻译： 公开了一种用于喷墨打印头的部件及其制造方法，其中使用光敏聚合物作为基底。 通过光刻在基板上制造孔和墨室。 用于与打印头芯片互连的导电迹线通过组合光刻和电铸工艺而集成到衬底中。
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公开(公告)号：US07108961B2
公开(公告)日：2006-09-19
申请号：US10702555
申请日：2003-11-07
申请人： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
发明人： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
IPC分类号： B41J2/16
CPC分类号： B41J2/16 , B41J2/1625 , B41J2/1626 , B41J2/1631 , B41J2/1639 , H05K3/0023 , H05K3/205 , H05K2201/09063 , H05K2201/0969
摘要： A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
摘要翻译： 公开了一种用于喷墨打印头的部件及其制造方法，其中使用光敏聚合物作为基底。 通过光刻在基板上制造孔和墨室。 用于与打印头芯片互连的导电迹线通过组合光刻和电铸工艺而集成到衬底中。
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