发明申请
- 专利标题： Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
- 专利标题（中）： 化学机械抛光水性分散体和化学机械抛光方法
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申请号： US11038190申请日： 2005-01-21
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公开(公告)号： US20050164510A1公开(公告)日： 2005-07-28
- 发明人: Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
- 申请人： Norihiko Ikeda , Kazuo Nishimoto , Masayuki Hattori , Nobuo Kawahashi
- 申请人地址： JP Tokyo
- 专利权人： JSR CORPORATION
- 当前专利权人： JSR CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-16270 20040123
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; C09K3/14 ; H01L21/304 ; H01L21/306 ; H01L21/3105 ; H01L21/302 ; H01L21/461
摘要：
A chemical mechanical polishing aqueous dispersion comprises abrasives (A) containing ceria, an anionic water-soluble polymer (B) and a cationic surfactant (C), wherein the amount of the anionic water-soluble polymer (B) is in the range of 60 to 600 parts by mass based on 100 parts by mass of the abrasives (A) containing ceria, and the amount of the cationic surfactant (C) is in the range of 0.1 to 100 ppm based on the whole amount of the chemical mechanical polishing aqueous dispersion.