发明申请
- 专利标题： Wiring board and semiconductor package using the same
- 专利标题（中）： 接线板和半导体封装使用相同
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申请号： US11125158申请日： 2005-05-10
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公开(公告)号： US20050252682A1公开(公告)日： 2005-11-17
- 发明人: Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
- 申请人： Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
- 专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 优先权： JP2004-142133 20040512
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/48 ; H01L21/68 ; H01L23/14 ; H01L23/498 ; H01L25/065 ; H05K1/03 ; H05K1/11 ; H05K3/20 ; H05K3/42
摘要：
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D-65/D150)≦3.0 (5) H23≧140 (6) (H-65/H150)≦2.3
公开/授权文献
- US07397000B2 Wiring board and semiconductor package using the same 公开/授权日：2008-07-08
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