发明申请
US20050255611A1 Defect identification system and method for repairing killer defects in semiconductor devices
审中-公开
缺陷识别系统和修复半导体器件杀伤性缺陷的方法
- 专利标题： Defect identification system and method for repairing killer defects in semiconductor devices
- 专利标题（中）： 缺陷识别系统和修复半导体器件杀伤性缺陷的方法
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申请号： US10911142申请日： 2004-08-04
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公开(公告)号： US20050255611A1公开(公告)日： 2005-11-17
- 发明人: Oliver Patterson , David Shuttleworth , Bradley Albers , Werner Weck , Gregory Brown
- 申请人： Oliver Patterson , David Shuttleworth , Bradley Albers , Werner Weck , Gregory Brown
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; G01R31/28 ; H01L21/66 ; H01L21/768
摘要：
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.
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