Invention Application
- Patent Title: METHOD FOR CLEANING POST-ETCH NOBLE METAL RESIDUES
- Patent Title (中): 清除后处理金属残留物的方法
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Application No.: US11669759Application Date: 2007-01-31
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Publication No.: US20070298521A1Publication Date: 2007-12-27
- Inventor: Yaw S. Obeng , Kezhakkedath R. Udayakumar , Scott Robert Summerfelt , Sanjeev Aggarwal , Francis Gabriel Celii , Lindsey H. Hall , Robert Kraft , Theodore S. Moise
- Applicant: Yaw S. Obeng , Kezhakkedath R. Udayakumar , Scott Robert Summerfelt , Sanjeev Aggarwal , Francis Gabriel Celii , Lindsey H. Hall , Robert Kraft , Theodore S. Moise
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of manufacturing a semiconductor device is presented. In one aspect, the method comprises forming conductive and ferroelectric material layers on a semiconductor substrate. The material layers are patterned to form electrodes and a ferroelectric layer of a ferroelectric capacitor, wherein a conductive noble metal-containing polymer is generated on sidewalls of the ferroelectric capacitor. The method also comprises converting the conductive noble metal-containing polymer into a non-conducting metal oxide. Converting includes forming a water-soluble metal salt from the conductive noble metal-containing polymer and reacting the water-soluble metal salt with an acqueous acidic solution to form a metal hydroxide. Converting also includes oxidizing the metal hydroxide to form the non-conducting metal oxide.
Public/Granted literature
- US07723199B2 Method for cleaning post-etch noble metal residues Public/Granted day:2010-05-25
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