发明申请
- 专利标题： Electronic device and method of fabricating the same
- 专利标题（中）： 电子装置及其制造方法
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申请号： US11598816申请日： 2006-11-14
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公开(公告)号： US20080111247A1公开(公告)日： 2008-05-15
- 发明人: Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
- 申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
- 专利权人： Fujitsu Media Devices Limited
- 当前专利权人： Fujitsu Media Devices Limited
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; B23K31/02 ; H01L21/60
摘要：
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
公开/授权文献
- US08093101B2 Electronic device and method of fabricating the same 公开/授权日：2012-01-10
信息查询
IPC分类:
