发明申请
- 专利标题: ELECTRONICS COMPONENT EMBEDDED PCB
- 专利标题(中): 电子元件嵌入式PCB
-
申请号: US12915707申请日: 2010-10-29
-
公开(公告)号: US20110100689A1公开(公告)日: 2011-05-05
- 发明人: Jung-Soo BYUN , Yul-Kyo Chung , Hwa-Sun Park , Kyung-Min Lee , Mike Kim , Doo-Hwan Lee
- 申请人: Jung-Soo BYUN , Yul-Kyo Chung , Hwa-Sun Park , Kyung-Min Lee , Mike Kim , Doo-Hwan Lee
- 优先权: KR10-2009-0103766 20091029
- 主分类号: H05K1/16
- IPC分类号: H05K1/16 ; H05K1/00
摘要:
An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.
公开/授权文献
- US08618421B2 Electronics component embedded PCB 公开/授权日:2013-12-31