公开(公告)号：US20110100689A1

公开(公告)日：2011-05-05

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

发明人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110216515A1

公开(公告)日：2011-09-08

申请号：US12852063

申请日：2010-08-06

申请人： Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

发明人： Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

IPC分类号： H05K1/18 ,  B32B38/10 ,  B32B38/04

CPC分类号： B32B38/04 ,  B32B38/10 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/351 ,  H05K1/18 ,  H01L2924/00

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，通过以下方式制造电子装置嵌入式印刷电路板：通过面朝下方法将第一电子装置粘附在支撑体上; 通过面朝上方法将第二电子装置粘附在第一电子装置的上表面上; 在支撑体的上侧堆叠纯树脂层和增强层，其中第一电装置和第二电装置嵌入在纯树脂层中; 去除支撑体; 在第一电子装置的下侧堆叠绝缘层，浸渍在绝缘层中的增强材料; 并且在每个加强层和绝缘层上构图电路。

公开(公告)号：US08206530B2

公开(公告)日：2012-06-26

申请号：US12351261

申请日：2009-01-09

申请人： Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

发明人： Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

IPC分类号： B29C65/00 ,  B32B37/00

CPC分类号： H05K1/185 ,  B32B37/02 ,  B32B2038/0016 ,  B32B2310/0843 ,  B32B2457/08 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/10674 ,  H05K2203/025 ,  H05K2203/1469 ,  Y10T156/10 ,  H01L2224/82

摘要： A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.

摘要翻译： 公开了具有电子部件的印刷电路板的制造方法。 根据本发明的实施例的方法包括：将粘合片的上侧上的在上侧形成电极的电子部件放置; 在所述接合片的上侧设置有与所述电子部件相对应的空腔的绝缘体; 在绝缘子的上侧层叠第一绝缘树脂，使得电子部件的上侧被覆盖; 抛光第一绝缘树脂使得电极暴露; 以及在抛光的第一绝缘树脂上形成与暴露的电极电连接的第一电路图案。

公开(公告)号：US20100006203A1

公开(公告)日：2010-01-14

申请号：US12351261

申请日：2009-01-09

申请人： Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

发明人： Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

IPC分类号： B32B37/02

CPC分类号： H05K1/185 ,  B32B37/02 ,  B32B2038/0016 ,  B32B2310/0843 ,  B32B2457/08 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/10674 ,  H05K2203/025 ,  H05K2203/1469 ,  Y10T156/10 ,  H01L2224/82

摘要： A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.

摘要翻译： 公开了具有电子部件的印刷电路板的制造方法。 根据本发明的实施例的方法包括：将粘合片的上侧上的在上侧形成电极的电子部件放置; 在所述接合片的上侧设置有与所述电子部件相对应的空腔的绝缘体; 在绝缘子的上侧层叠第一绝缘树脂，使得电子部件的上侧被覆盖; 抛光第一绝缘树脂使得电极暴露; 以及在抛光的第一绝缘树脂上形成与暴露的电极电连接的第一电路图案。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US08284562B2

公开(公告)日：2012-10-09

申请号：US12877684

申请日：2010-09-08

申请人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US07947906B2

公开(公告)日：2011-05-24

申请号：US11528322

申请日：2006-09-28

申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/02 ,  H05K1/00

CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

摘要： A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

摘要翻译： 一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物 层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。

公开(公告)号：US20090124043A1

公开(公告)日：2009-05-14

申请号：US12149837

申请日：2008-05-08

申请人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

IPC分类号： H01L21/52

CPC分类号： H05K1/187 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1469

摘要： A method of manufacturing a package board is disclosed. The method is for manufacturing a package board that has a pad electrically connected with a component, and includes: forming an indentation, which is in correspondence with the pad, in one side of a first insulating layer; filling a metal paste in the indentation; mounting the component on the first insulating layer in correspondence with a location of the indentation; and hardening the metal paste. Using this method, damage to the component can be prevented during the forming of vias, as the component is mounted after filling paste in an indentation formed in an insulating layer.

摘要翻译： 公开了一种制造封装板的方法。 该方法用于制造具有与部件电连接的焊盘的封装板，并且包括：在第一绝缘层的一侧形成与焊盘相对应的凹陷; 在压痕中填充金属膏; 将零件安装在与压痕位置对应的第一绝缘层上; 并硬化金属膏。 使用这种方法，在形成通孔期间可以防止部件的损坏，因为在将糊料填充在形成在绝缘层中的凹陷中之后安装部件。

公开(公告)号：US07348772B2

公开(公告)日：2008-03-25

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。