公开(公告)号：US08618421B2

公开(公告)日：2013-12-31

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

发明人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110100689A1

公开(公告)日：2011-05-05

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

发明人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110048780A1

公开(公告)日：2011-03-03

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16 ,  H05K3/10

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US08633397B2

公开(公告)日：2014-01-21

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US20110123808A1

公开(公告)日：2011-05-26

申请号：US12774432

申请日：2010-05-05

申请人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

发明人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

IPC分类号： B32B9/04 ,  B29C65/52 ,  B32B27/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H05K3/4602 ,  H05K2201/0195 ,  Y10T156/10 ,  Y10T428/31504

摘要： An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

摘要翻译： 公开了一种使用绝缘体的电子部件嵌入式印刷电路板的绝缘体和制造方法。 该方法包括提供具有形成在其表面上的电路图案的芯板，其中芯板被腔体穿透，将覆盖空腔的粘合剂层粘附到芯板的下表面，将电子部件放置在 粘合剂层的上表面，其上表面对应于空腔，并且在芯板的上表面上堆叠绝缘体以填充空腔，绝缘体具有上树脂层和下树脂层 分别形成在增强材料的上表面和下表面上。 绝缘体具有不对称结构，其中下树脂层比上树脂层厚。

公开(公告)号：US20110216515A1

公开(公告)日：2011-09-08

申请号：US12852063

申请日：2010-08-06

申请人： Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

发明人： Jin-Won LEE ,  Yul-Kyo Chung ,  Doo-Hwan Lee ,  Seung-Hyun Sohn ,  Dae-Jung Byun

IPC分类号： H05K1/18 ,  B32B38/10 ,  B32B38/04

CPC分类号： B32B38/04 ,  B32B38/10 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/351 ,  H05K1/18 ,  H01L2924/00

摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.

摘要翻译： 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，通过以下方式制造电子装置嵌入式印刷电路板：通过面朝下方法将第一电子装置粘附在支撑体上; 通过面朝上方法将第二电子装置粘附在第一电子装置的上表面上; 在支撑体的上侧堆叠纯树脂层和增强层，其中第一电装置和第二电装置嵌入在纯树脂层中; 去除支撑体; 在第一电子装置的下侧堆叠绝缘层，浸渍在绝缘层中的增强材料; 并且在每个加强层和绝缘层上构图电路。

公开(公告)号：US20110005823A1

公开(公告)日：2011-01-13

申请号：US12774397

申请日：2010-05-05

申请人： Sang-Chul LEE ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

发明人： Sang-Chul LEE ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K3/305 ,  H01L21/568 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/3511 ,  H01L2924/35121 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139

摘要： An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.

摘要翻译： 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例，该方法包括提供一种具有形成在其表面上的电路图案的芯板，其中芯板被空腔穿透，将粘合剂层粘附到芯板的下表面 以覆盖空腔，将电子部件设置在粘合剂层的上表面上，与空腔对应的上表面，通过在芯板的上表面上堆叠第一绝缘体来覆盖电路图案，使得空腔为 填充有第一绝缘体，其中没有填充衬垫材料，并且在电缆板的上下两侧堆叠第二绝缘体，其中第二绝缘体具有填充在其中的背衬材料。

公开(公告)号：US07730612B2

公开(公告)日：2010-06-08

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一绝缘层上形成盲孔以使第一绝缘层被暴露，对于包覆层叠在第一绝缘层上的第一金属层的覆金属层压板，将部件固定在第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US20100097770A1

公开(公告)日：2010-04-22

申请号：US12406636

申请日：2009-03-18

申请人： Hwa-Sun Park ,  Yul-Kyo Chung ,  Jong-Man Kim ,  One-Cheol Bae

发明人： Hwa-Sun Park ,  Yul-Kyo Chung ,  Jong-Man Kim ,  One-Cheol Bae

IPC分类号： H05K1/16 ,  H05K3/46 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K1/185 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2225/06524 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0269 ,  H05K3/305 ,  H05K3/386 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/09918 ,  H05K2201/10515 ,  H05K2203/063 ,  H05K2203/066 ,  Y10T156/1052

摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板的制造方法包括：将电子器件安装在粘合剂层的上表面上; 分别在电子设备的上侧和粘合剂层的下侧层叠绝缘体，使得电子器件被埋置; 并在绝缘体上形成电路图案和通孔。

公开(公告)号：US08482890B2

公开(公告)日：2013-07-09

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H3/22

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。