Invention Application
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 高电子移动性晶体管及其制造方法
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Application No.: US14091822Application Date: 2013-11-27
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Publication No.: US20140151749A1Publication Date: 2014-06-05
- Inventor: Woo-chul JEON , Jong-seob KIM , Ki-yeol PARK , Young-hwan PARK , Jai-kwang SHIN , Jae-joon OH , Hyuk-soon CHOI , In-jun HWANG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2012-0138512 20121130
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L29/66

Abstract:
According to example embodiments, a high electron mobility transistor (HEMT) includes a channel layer; a channel supply layer on the channel layer; a source electrode and a drain electrode spaced apart from each other on one of the channel layer and the channel supply layer; a gate electrode on a part of the channel supply layer between the source electrode and the drain electrode; a first depletion-forming layer between the gate electrode and the channel supply layer; and a at least one second depletion-forming layer on the channel supply layer between the gate electrode and the drain electrode. The at least one second depletion-forming layer is electrically connected to the source electrode.
Public/Granted literature
- US09245738B2 High electron mobility transistor and method of manufacturing the same Public/Granted day:2016-01-26
Information query
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