Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Patent Title (中): 半导体封装及其制造方法
-
Application No.: US13971189Application Date: 2013-08-20
-
Publication No.: US20140353850A1Publication Date: 2014-12-04
- Inventor: Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen , Chih-Ming Cheng , Yude Chu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Priority: TW102118734 20130528
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/56 ; H01L23/28 ; H01L23/12 ; H01L23/00
Abstract:
A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.
Public/Granted literature
- US09502377B2 Semiconductor package and fabrication method thereof Public/Granted day:2016-11-22
Information query
IPC分类:
