Invention Application
- Patent Title: TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY
- Patent Title (中): 通过整合电路的光学层传输热量
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Application No.: US14633069Application Date: 2015-02-26
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Publication No.: US20150221575A1Publication Date: 2015-08-06
- Inventor: Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: H01L23/367
- IPC: H01L23/367 ; G02B6/122 ; G06F17/50

Abstract:
A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.
Public/Granted literature
- US09337122B2 Transferring heat through an optical layer of integrated circuitry Public/Granted day:2016-05-10
Information query
IPC分类: