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    Computer program product for electro-optical assembly
    1.
    发明授权
    Computer program product for electro-optical assembly 有权
    用于电光装配的计算机程序产品

    公开(公告)号：US09323009B2

    公开(公告)日：2016-04-26

    申请号：US14243075

    申请日：2014-04-02

    申请人： International Business Machines Corporation

    发明人： Stefano Sergio Oggioni ,  Jonas R. Weiss ,  Bert Jan Offrein

    IPC分类号： G02B6/13 ,  G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  H05K13/00 ,  G02B6/38 ,  H05K1/18 ,  H05K3/34 ,  G02B6/12

    CPC分类号： G02B6/42 ,  G02B6/13 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12166 ,  H05K1/0274 ,  H05K1/184 ,  H05K1/189 ,  H05K3/3405 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/0195 ,  Y10T29/49002 ,  Y10T29/49037 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53

    摘要： A computer program product for fabricating an optical assembly having stored computer readable program code including a first program to place a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate upon a horizontally movable stage of a flip-chip bonder, a second program to vertically move a clamp through the stage opening to place the waveguide exposed end in a vertical position, a third program to vertically downwardly move a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide, a fourth program to fixably mount the optical component to the substrate edge, and a fifth program to release the optical component from the bond head while moving the clamp vertically downward through the stage opening unbending the flexible portion of the substrate with the optical component mounted thereon.

    摘要翻译： 一种用于制造具有存储的计算机可读程序代码的计算机程序产品，所述计算机可读程序代码包括第一程序，以放置包括波导的基板的柔性部分，所述波导在所述基板的一个端部边缘暴露在触发器的水平移动台上， 第二程序，用于垂直移动夹具穿过平台开口以将波导暴露端放置在垂直位置;第三程序，用于垂直向下移动包含光学部件的接合头在波导暴露的基板边缘上以将光学 具有暴露的波导的组件，将光学部件可固定地安装到基板边缘的第四程序，以及第五程序，用于在将夹具垂直向下移动通过平台开口的同时从接合头释放光学部件，而不弯曲基板的柔性部分 其上安装有光学部件。

    Adaptive optical interconnection of components of an electro-optical circuit
    3.
    发明授权
    Adaptive optical interconnection of components of an electro-optical circuit 有权
    电光电路部件的自适应光互连

    公开(公告)号：US09389362B1

    公开(公告)日：2016-07-12

    申请号：US14941856

    申请日：2015-11-16

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Thomas J. Brunschwiler ,  Antonio La Porta ,  Bert J. Offrein ,  Jonas R. Weiss

    IPC分类号： G02B6/12 ,  H01L25/00 ,  G02B6/138 ,  G02B6/132 ,  G02B6/42

    CPC分类号： G02B6/12004 ,  G02B6/138 ,  G02B6/4255 ,  G02B6/4283 ,  G02B6/4292 ,  H01L21/568 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2924/14

    摘要： Embodiments include a method for interconnecting components of an optical circuit. The method includes arranging the components on a support layer and embedding them within a material, such that portions of the material that is between the components contact the support layer. The obtained components are positioned with a certain inaccuracy with respect to ideal nominal positions thereof. Next, the support layer is removed to reveal one side of the components, on which side the components are level with said portions of said material. Positions of the components are identified and a set of optical polymer waveguides are adaptively fabricated, on the one side, so as for each of the fabricated polymer waveguides to optically connect subsets of two or more of the components, according to the identified positions of the components. The present invention is further directed to related optical circuits or electro-optical circuits of interconnected components.

    摘要翻译： 实施例包括用于互连光学电路的部件的方法。 该方法包括将部件布置在支撑层上并将其嵌入材料内，使得部件之间的部件接触支撑层。 所获得的部件相对于其理想的标称位置具有一定的不准确度。 接下来，去除支撑层以露出部件的一侧，在该侧部件与所述材料的所述部分平齐。 识别部件的位置，并且在一侧上自适应地制造一组光学聚合物波导，以便根据所识别的位置，制造的聚合物波导中的每一个光学连接两个或更多个部件的子集 组件。 本发明还涉及相关组件的相关光电路或电光电路。

    Fabricating an optical assembly
    4.
    发明授权
    Fabricating an optical assembly 有权
    制造光学组件

    公开(公告)号：US09274289B2

    公开(公告)日：2016-03-01

    申请号：US13676351

    申请日：2012-11-14

    申请人： International Business Machines Corporation

    发明人： Stefano Sergio Oggioni ,  Jonas R. Weiss ,  Bert Jan Offrein

    IPC分类号： G02B6/36 ,  G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  G02B6/13 ,  H05K13/00 ,  G02B6/38 ,  H05K1/18 ,  H05K3/34 ,  G02B6/12

    CPC分类号： G02B6/42 ,  G02B6/13 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12166 ,  H05K1/0274 ,  H05K1/184 ,  H05K1/189 ,  H05K3/3405 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/0195 ,  Y10T29/49002 ,  Y10T29/49037 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53

    摘要： Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

    摘要翻译： 实施例提供了具有倒装芯片连接器的开口的水平移动平台，包括至少一个柔性部分和波导的基板，该波导在位于台面上的基板的一个端部边缘处露出，端部边缘超过 开口，垂直向上可移动的夹具，其大小适于穿透平台开口并且定位在平台下方，在平台开口上方具有垂直向下可移动的接合头，定位在头部中的光学部件，定位成将胶水提供给配合表面 衬底暴露的端边缘或光学部件的配合表面，以及连接到平台，夹具，头部和分配器的控制器，包括用于将衬底波导暴露的端部边缘定位在光学部件下方的控制电路，同时分配用于可固定的胶 粘合光学部件的配合表面和基板暴露的端部边缘。

    Distributed electrostatic discharge protection circuit with magnetically coupled differential inputs and outputs
    9.
    发明授权
    Distributed electrostatic discharge protection circuit with magnetically coupled differential inputs and outputs 有权
    具有磁耦合差分输入和输出的分布式静电放电保护电路

    公开(公告)号：US09397087B1

    公开(公告)日：2016-07-19

    申请号：US14967332

    申请日：2015-12-13

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Lukas Kull ,  Thomas E. Morf ,  Jonas R. Weiss

    IPC分类号： H02H3/00 ,  H02H9/02 ,  H01L27/02 ,  H01L23/66

    CPC分类号： H01L23/5227 ,  H01L27/0288 ,  H01L27/0292

    摘要： A distributed electrostatic discharge protection circuit includes a plurality of electrostatic discharge protection elements and a current balancing network connecting the plurality of electrostatic discharge protection elements. The current balancing network is configured in a return path of the distributed electrostatic discharge protection circuit such that during an electrostatic discharge (ESD) event, the circuit provides predefined current density within each of the electrostatic discharge protection elements.

    摘要翻译： 分布式静电放电保护电路包括多个静电放电保护元件和连接多个静电放电保护元件的电流平衡网络。 电流平衡网络配置在分布式静电放电保护电路的返回路径中，使得在静电放电（ESD）事件期间，电路在每个静电放电保护元件内提供预定的电流密度。