Invention Application
- Patent Title: LIGHT-EMITTING DEVICE AND PEELING METHOD
- Patent Title (中): 发光装置和剥离方法
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Application No.: US14621914Application Date: 2015-02-13
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Publication No.: US20150236280A1Publication Date: 2015-08-20
- Inventor: Tatsuya SAKUISHI , Yutaka UCHIDA , Hiroki ADACHI , Saki EGUCHI , Junpei YANAKA , Kayo KUMAKURA , Seiji YASUMOTO , Kohei YOKOYAMA , Akihiro CHIDA
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2014-029756 20140219
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L27/32 ; B32B38/10 ; B32B7/02 ; B32B37/02 ; B32B37/18 ; H01L51/56 ; H01L51/52
Abstract:
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Public/Granted literature
- US09437832B2 Light-emitting device and peeling method Public/Granted day:2016-09-06
Information query
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