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公开(公告)号：US20180076401A1
公开(公告)日：2018-03-15
申请号：US15810249
申请日：2017-11-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya SAKUISHI , Yutaka UCHIDA , Hiroki ADACHI , Saki EGUCHI , Junpei YANAKA , Kayo KUMAKURA , Seiji YASUMOTO , Kohei YOKOYAMA , Akihiro CHIDA
CPC classification number: H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
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公开(公告)号：US20200057330A1
公开(公告)日：2020-02-20
申请号：US16346660
申请日：2017-11-01
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei YAMAZAKI , Kohei YOKOYAMA , Takaaki NAGATA , Tatsuya SAKUISHI , Akio YAMASHITA , Yasuhiro JINBO , Hideaki SHISHIDO , Tetsuji ISHITANI
IPC: G02F1/1368 , G02F1/1333 , G02F1/1362
Abstract: A display device that can switch between normal display and see-through display is provided. Visibility in see-through display is improved. A liquid crystal element overlaps with a light-emitting element. The light-emitting element, a transistor, and the like overlapping with the liquid crystal element transmit visible light. When the liquid crystal element blocks external light, an image is displayed with the light-emitting element. When the liquid crystal element transmits external light, an image displayed with the light-emitting element is superimposed on a transmission image through the liquid crystal element.
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3.发明申请METHOD FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 有权用于制造显示器件的方法和用于制造电子器件的方法公开(公告)号：US20150250038A1
公开(公告)日：2015-09-03
申请号：US14628461
申请日：2015-02-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya SAKUISHI , Daiki NAKAMURA , Akihiro CHIDA , Tomoya AOYAMA
CPC classification number: H01L51/56 , B32B38/105 , B32B2310/0843 , B32B2457/20 , H01L27/1218 , H01L27/1225 , H01L27/124 , H01L27/1266 , H01L27/322 , H01L27/3276 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L2227/323 , H01L2227/326 , H01L2251/5338
Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.
Abstract translation: 提供一种制造显示装置的方法。 该方法包括形成插入在第一基板和第二基板之间的显示元件，并且从第一基板剥离第二基板，使得位于第一和第二基板之间并连接到外部电极的电极被暴露 同时第二基板的剥离。
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4.发明申请公开(公告)号：US20220416183A1
公开(公告)日：2022-12-29
申请号：US17899816
申请日：2022-08-31
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Takaaki NAGATA , Tatsuya SAKUISHI , Kohei YOKOYAMA , Yasuhiro JINBO , Taisuke KAMADA , Akihiro CHIDA
Abstract: A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.
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5.发明申请公开(公告)号：US20180151852A1
公开(公告)日：2018-05-31
申请号：US15880601
申请日：2018-01-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya SAKUISHI , Daiki NAKAMURA , Akihiro CHIDA , Tomoya AOYAMA
CPC classification number: H01L51/56 , B32B38/105 , B32B2310/0843 , B32B2457/20 , H01L27/1218 , H01L27/1225 , H01L27/124 , H01L27/1266 , H01L27/322 , H01L27/3276 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L2227/323 , H01L2227/326 , H01L2251/5338
Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.
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Patent Agency Ranking
公开(公告)号：US20170330903A1
公开(公告)日：2017-11-16
申请号：US15591156
申请日：2017-05-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro CHIDA , Tatsuya SAKUISHI , Daiki NAKAMURA , Tomoya AOYAMA , Kohei YOKOYAMA , Daisuke KUBOTA
CPC classification number: H01L27/1266 , H01L27/124 , H01L27/3262 , H01L27/3276 , H01L29/78648 , H01L29/7869 , H01L51/0021 , H01L51/003 , H01L2227/323 , H01L2251/5338
Abstract: A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.
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公开(公告)号：US20180052535A1
公开(公告)日：2018-02-22
申请号：US15673769
申请日：2017-08-10
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Tatsuya SAKUISHI , Kohei YOKOYAMA , Yasuhiro JINBO
IPC: G06F3/0354
CPC classification number: G06F3/03545 , G06F3/03546 , G06F3/0412 , G06F3/044 , G06F2203/04103
Abstract: A highly usable touch pen and a method for providing input to an electronic device using the touch pen are provided. A ball that is formed using a material not slipping on the surface of an input portion of an electronic device and that can rotate in the touch pen is set at the tip of the touch pen. The ball includes an elastic material. Alternatively, the tip of the touch pen is movable. When input is provided to an electronic device by moving the touch pen, the tip of which is provided with the ball formed using a material not slipping on the input portion surface of the electronic device, the ball rolls on the input portion surface while providing input.
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公开(公告)号：US20170092885A1
公开(公告)日：2017-03-30
申请号：US15252295
申请日：2016-08-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya SAKUISHI , Yutaka UCHIDA , Hiroki ADACHI , Saki EGUCHI , Junpei YANAKA , Kayo KUMAKURA , Seiji YASUMOTO , Kohei YOKOYAMA , Akihiro CHIDA
CPC classification number: H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
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9.发明申请公开(公告)号：US20160315134A1
公开(公告)日：2016-10-27
申请号：US15098444
申请日：2016-04-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yusuke NISHIDO , Tatsuya SAKUISHI
CPC classification number: H01L27/3276 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2251/5338 , H05K1/11 , H05K3/0044 , H05K3/0047 , H05K3/0052 , H05K3/288 , H05K3/361 , H05K2201/09127 , H05K2203/0228 , Y02E10/549 , Y02P70/521
Abstract: A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.
Abstract translation: 制造电极损伤减少的电路板或电极损伤减少的发光装置。 制造电路板或发光装置的方法包括以下步骤：在第一基板上形成包括电路和端子电极的处理部件，在端子电极上方的分离层，分离层上的接合层， 和在所述接合层上的第二衬底; 使用能够旋转切削加工的刀片在所述加工构件中形成槽; 以及去除所述分离层的一部分，所述结合层的一部分和所述第二基板的一部分以暴露所述端子电极的一部分。
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10.发明申请Method for Manufacturing Display Device and Method for Manufacturing Electronic Device 有权制造显示装置的方法及制造电子装置的方法公开(公告)号：US20150263314A1
公开(公告)日：2015-09-17
申请号：US14644749
申请日：2015-03-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya SAKUISHI , Daiki NAKAMURA , Akihiro CHIDA , Tomoya AOYAMA
CPC classification number: H01L51/0097 , H01L27/3244 , H01L27/3276 , H01L51/003 , H01L51/5012 , H01L51/5203 , H01L2227/326 , Y02E10/549 , Y02P70/521
Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.
Abstract translation: 提供一种制造显示装置的方法。 该方法包括：在第一基板和第二基板之间形成包括电致发光层的发光元件和通过使用电致发光层的材料形成的剥离层的布线; 并且将第二基板的整体从第一基板剥离，使得布线上的剥离层同时暴露。
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