Invention Application
US20150364367A1 SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER
审中-公开
具有低电阻波形的半导体结构通过一个波形
- Patent Title: SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER
- Patent Title (中): 具有低电阻波形的半导体结构通过一个波形
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Application No.: US14832024Application Date: 2015-08-21
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Publication No.: US20150364367A1Publication Date: 2015-12-17
- Inventor: Jeffrey P. GAMBINO , Thomas J. HARTSWICK , Zhong-Xiang HE , Anthony K. STAMPER , Eric J. WHITE
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/3205 ; H01L21/288
Abstract:
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low resistance conduction path on a wafer, and forming an electroplated seed layer in direct contact with the low resistance conduction path.
Public/Granted literature
- US10438803B2 Semiconductor structures having low resistance paths throughout a wafer Public/Granted day:2019-10-08
Information query
IPC分类:
