Invention Application
US20160064298A1 Embedding additive particles in encapsulant of electronic device
有权
将添加剂颗粒嵌入电子设备的密封剂中
- Patent Title: Embedding additive particles in encapsulant of electronic device
- Patent Title (中): 将添加剂颗粒嵌入电子设备的密封剂中
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Application No.: US14835750Application Date: 2015-08-26
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Publication No.: US20160064298A1Publication Date: 2016-03-03
- Inventor: Peh Hean TEH , Jagen Krishnan , Swee Kah Lee , Poh Cheng Lim , Joachim Mahler , Chew Theng Tai , Yik Yee Tan , Soon Lock Goh
- Applicant: Infineon Technologies AG
- Priority: DE102014112406.5 20140828
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/3105 ; H01L23/00 ; H01L21/56 ; H01L23/495 ; H01L23/31
Abstract:
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Public/Granted literature
- US09852918B2 Embedding additive particles in encapsulant of electronic device Public/Granted day:2017-12-26
Information query
IPC分类:
