公开(公告)号：US20160064298A1

公开(公告)日：2016-03-03

申请号：US14835750

申请日：2015-08-26

Applicant: Infineon Technologies AG

Inventor： Peh Hean TEH ,  Jagen Krishnan ,  Swee Kah Lee ,  Poh Cheng Lim ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh

IPC: H01L23/29 ,  H01L21/3105 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L21/3105 ,  C09J163/00 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8392 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

Abstract translation: 一种电子设备，包括具有安装表面的载体，安装在所述安装表面上的至少一个电子芯片，至少部分地封装所述载体和所述至少一个电子芯片的密封剂以及所述密封剂中的多个胶囊，其中所述胶囊 包括包含添加剂的芯，并且包括封装芯的壳，特别是可裂纹壳。

公开(公告)号：US09852918B2

公开(公告)日：2017-12-26

申请号：US14835750

申请日：2015-08-26

Applicant: Infineon Technologies AG

Inventor： Peh Hean Teh ,  Jagen Krishnan ,  Swee Kah Lee ,  Poh Cheng Lim ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh

IPC: H01L23/29 ,  H01L21/3105 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  C09J163/00

CPC classification number: H01L21/3105 ,  C09J163/00 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8392 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

公开(公告)号：US09540539B2

公开(公告)日：2017-01-10

申请号：US14287231

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Swee Kah Lee ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh ,  Poh Cheng Lim ,  Jagen Krishnan ,  Peh Hean Teh

IPC: C09D179/04 ,  H01L23/29 ,  C09D5/08 ,  C09D163/00 ,  H01L21/56 ,  C08G14/06 ,  C09D161/34

CPC classification number: C09D179/04 ,  C08G14/06 ,  C09D5/002 ,  C09D5/08 ,  C09D161/34 ,  C09D163/00 ,  H01L21/565 ,  H01L23/296 ,  H01L23/3142 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08K5/544 ,  C08L63/00

Abstract: A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.

Abstract translation: 提供底漆组合物。 底漆组合物包括至少一种双官能或多官能苯并恶嗪化合物; 和至少一种包含对金属表面具有亲和性的官能团的化合物和可交联基团。 还提供了在半导体器件上形成底漆层的方法以及封装半导体器件的方法。

公开(公告)号：US09817079B2

公开(公告)日：2017-11-14

申请号：US14336305

申请日：2014-07-21

Applicant: Infineon Technologies AG

Inventor： Choo Tian Ooi ,  Chew Theng Tai ,  Klaus Elian ,  Mohd Hirzarul Hafiz Mohd Tahir

IPC: H01L21/00 ,  G01R33/00

CPC classification number: G01R33/0047 ,  G01R33/0052 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

公开(公告)号：US20160018476A1

公开(公告)日：2016-01-21

申请号：US14336305

申请日：2014-07-21

Applicant: Infineon Technologies AG

Inventor： Choo Tian Ooi ,  Chew Theng Tai ,  Klaus Elian ,  Mohd Hirzarul Hafiz Mohd Tahir

IPC: G01R33/00

CPC classification number: G01R33/0047 ,  G01R33/0052 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

Abstract translation: 模制传感器封装包括具有附接到引线框的传感器芯片的引线框架，与传感器管芯对准的磁体和封装传感器管芯的单个模制化合物并将磁体附接到引线框架。 制造模制的传感器封装的方法包括将磁体和引线框架加载到模制工具中，使得磁体与模制工具中的传感器模具对准，并将模具与模具组合在一起，同时装载在模具中 模制工具并固化模塑料，使得磁体通过封装传感器模具的相同模塑料附接到引线框架上。