Invention Application
US20170047509A1 DEVICES USING CAVITIES TO DISTRIBUTE CONDUCTIVE PATTERNING RESIDUE AND DEVICES FABRICATED USING THE SAME
审中-公开
使用CAVITIES分配导电花纹块的装置和使用该装置制作的装置
- Patent Title: DEVICES USING CAVITIES TO DISTRIBUTE CONDUCTIVE PATTERNING RESIDUE AND DEVICES FABRICATED USING THE SAME
- Patent Title (中): 使用CAVITIES分配导电花纹块的装置和使用该装置制作的装置
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Application No.: US15340330Application Date: 2016-11-01
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Publication No.: US20170047509A1Publication Date: 2017-02-16
- Inventor: Jongchul Park , BYOUNGJAE BAE , INHO KIM , SHIN KWON , EUNSUN NOH , INSUN PARK , SANGMIN LEE
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0001314 20140106
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L27/22 ; H01L43/12 ; H01L43/08 ; H01L43/10
Abstract:
Methods of manufacturing a semiconductor device include forming a conductive layer on a substrate, forming an air gap or other cavity between the conductive layer and the substrate, and patterning the conductive layer to expose the air gap. The methods may further include forming conductive pillars between the substrate and the conductive layer. The air gap may be positioned between the conductive pillars.
Public/Granted literature
- US10347819B2 Magnetic memory devices having conductive pillar structures including patterning residue components Public/Granted day:2019-07-09
Information query
IPC分类:
