Invention Application
US20170069788A1 FABRICATION OF THIN-FILM DEVICES USING SELECTIVE AREA EPITAXY 审中-公开
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FABRICATION OF THIN-FILM DEVICES USING SELECTIVE AREA EPITAXY
Abstract:
A thin film device described herein includes a first thin film layer, a second film layer and a heterostructure within the second film layer. The first thin film layer is atop a substrate. The second thin film layer is grown from the first thin film layer through a patterned mask, having openings, under selective area growth (SAG) conditions. The second thin film layer is configured to be released from the first thin film layer by etching a trench. The etched trench may provide access to the patterned mask and the patterned mask may be eliminated with a wet etchant.
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