Invention Application
- Patent Title: SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
-
Application No.: US15289782Application Date: 2016-10-10
-
Publication No.: US20170098682A1Publication Date: 2017-04-06
- Inventor: Eric Ladizinsky , Geordie Rose , Jeremy P. Hilton , Eugene Dantsker , Byong Hyop Oh
- Applicant: D-Wave Systems Inc.
- Main IPC: H01L27/18
- IPC: H01L27/18 ; G06N99/00 ; H01L39/24 ; H01L39/02 ; H01L39/22

Abstract:
Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
Public/Granted literature
- US09978809B2 Systems and methods for fabrication of superconducting integrated circuits Public/Granted day:2018-05-22
Information query
IPC分类: