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    Systems and methods for fabrication of superconducting integrated circuits
    1.
    发明授权
    Systems and methods for fabrication of superconducting integrated circuits 有权

    公开(公告)号：US10700256B2

    公开(公告)日：2020-06-30

    申请号：US15679963

    申请日：2017-08-17

    申请人： D-WAVE SYSTEMS INC.

    发明人： Eric Ladizinsky ,  Jeremy P. Hilton ,  Byong Hyop Oh ,  Paul I. Bunyk

    IPC分类号： H01L39/24 ,  H01L27/18 ,  H01L39/22 ,  H01L21/285 ,  H01L39/02 ,  H01L39/12 ,  B82Y10/00 ,  H01L21/768 ,  G06N10/00

    摘要： Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

    Systems and methods for increasing analog processor connectivity
    2.
    发明授权
    Systems and methods for increasing analog processor connectivity 有权

    公开(公告)号：US10268622B2

    公开(公告)日：2019-04-23

    申请号：US15418497

    申请日：2017-01-27

    申请人： D-Wave Systems Inc.

    发明人： Jeremy P. Hilton ,  Aidan Patrick Roy ,  Paul I. Bunyk ,  Andrew Douglas King ,  Kelly T. R. Boothby ,  Richard G. Harris ,  Chunqing Deng

    IPC分类号： G06F13/40 ,  G06F13/36 ,  G06N99/00

    摘要： Topologies for analog computing systems are provided. Qubits in the topology are grouped into cells, and cells are coupled to adjacent cells by inter-cell couplers. At least some cells are coupled to non-adjacent cells via long-range couplers. Long-range couplers may be arranged into coverings so that certain sets of qubits within a covering region may be coupled with a reduced number of couplers. Each cell within a covering region without a long-range coupler may be proximate to a cell with a long range coupler so that each cell within the covering region is no more than a certain coupling distance away from a long-range coupler. Long-range couplers may couple over a greater physical distance than inter-cell couplers. Long-range couplers may couple to qubits over a larger coupling region, and may extend across multiple crossing regions between qubits.

    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
    4.
    发明申请
    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：US20200274050A1

    公开(公告)日：2020-08-27

    申请号：US16870537

    申请日：2020-05-08

    申请人： D-WAVE SYSTEMS INC.

    发明人： Eric Ladizinsky ,  Jeremy P. Hilton ,  Byong Hyop Oh ,  Paul I. Bunyk

    IPC分类号： H01L39/24 ,  B82Y10/00 ,  H01L27/18 ,  H01L39/22 ,  H01L21/285 ,  H01L21/768 ,  H01L39/02 ,  H01L39/12

    摘要： Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

    Systems, methods, and apparatus for cryogenic refrigeration
    5.
    发明授权
    Systems, methods, and apparatus for cryogenic refrigeration 有权
    用于低温制冷的系统，方法和装置

    公开(公告)号：US09134047B2

    公开(公告)日：2015-09-15

    申请号：US13863218

    申请日：2013-04-15

    申请人： D-Wave Systems Inc.

    发明人： Randall C. Black ,  Jeremy P. Hilton ,  Geordie Rose

    IPC分类号： F25B9/12 ,  F25B9/10 ,  G06F1/20 ,  H05K7/20 ,  H01L39/02

    CPC分类号： F25B9/12 ,  F25B9/10 ,  G06F1/20 ,  G06F2200/201 ,  H01L39/02 ,  H05K7/20372

    摘要： Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system.

    摘要翻译： 低温制冷采用脉冲管冷冻机和稀释冰箱来提供极低温度的冷却，例如冷却超导处理器。 可以使用多个吸附泵实现连续低温循环制冷。 各种改进可以包括多个不同的热连接点，具有冷却结构的蒸发罐，和/或可以与吸附泵成一体的一个或多个气隙热交换器。 当系统温度超过低温温度时，储存器容积可以提供压力释放，从而减小系统的质量。 可以提供用于冷凝和蒸发的附加热交换器和/或单独路径。 可以使用多通道连接器，和/或由在低温下具有高比热容的再生材料形成的连接器。 柔性PCB可以提供体现温度梯度的部件的热连接。 可以例如经由可切换热化系统预先冷却各种部件。

    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
    6.
    发明申请
    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS 审中-公开
    超导集成电路制造系统与方法

    公开(公告)号：US20150187840A1

    公开(公告)日：2015-07-02

    申请号：US14589574

    申请日：2015-01-05

    申请人： D-Wave Systems Inc.

    发明人： Eric Ladizinsky ,  Geordie Rose ,  Jeremy P. Hilton ,  Eugene Dantsker ,  Byong Hyop Oh

    IPC分类号： H01L27/18 ,  H01L39/02 ,  H01L39/22 ,  H01L49/02

    CPC分类号： H01L27/18 ,  B82Y10/00 ,  G06N99/002 ,  H01L28/24 ,  H01L39/025 ,  H01L39/223 ,  H01L39/2406 ,  H01L39/2493 ,  Y10S977/707 ,  Y10S977/723 ,  Y10S977/943

    摘要： Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.

    摘要翻译： 各种技术和设备允许制造超导电路和结构，例如约瑟夫逊结，其可以例如在量子计算机中有用。 例如，可以制造具有插入在能够超导的两个元件或层之间的电介质结构或层的低磁通量噪声三层结构。 超导通孔可以直接覆盖约瑟夫逊结。 诸如约瑟夫逊结的结构可以承载在平坦化的电介质层上。 可以使用翅片来除去结构中的热量。 能够超导的通孔可以具有小于约1微米的宽度。 该结构可以例如通过通孔和/或带连接器耦合到电阻器。

    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
    7.
    发明申请
    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS 有权
    超导集成电路制造系统与方法

    公开(公告)号：US20150119252A1

    公开(公告)日：2015-04-30

    申请号：US14383837

    申请日：2013-03-07

    申请人： D-Wave Systems Inc.

    发明人： Eric Ladizinsky ,  Jeremy P. Hilton ,  Byong Hyop Oh ,  Paul I. Bunyk

    IPC分类号： H01L39/24 ,  H01L39/02 ,  H01L39/12 ,  H01L39/22

    CPC分类号： H01L39/2493 ,  B82Y10/00 ,  G06N99/002 ,  H01L27/18 ,  H01L39/025 ,  H01L39/125 ,  H01L39/22 ,  H01L39/223 ,  H01L39/24 ,  H01L39/2406

    摘要： Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

    摘要翻译： 各种技术和装置允许制造超导电路。 可以形成铌/氧化铝/铌三层，并形成单个的约瑟夫逊结（JJ）。 保护盖可以在制造过程中保护JJ。 可以形成混合电介质。 可以使用减法图案化和/或添加剂图案化来形成超导集成电路。 可以通过电镀和/或通过化学机械平面化抛光来沉积超导金属层。 内层电介质的厚度可以通过沉积工艺来控制。 衬底可以包括硅的基底和包括氧化铝的顶层。 可以停止或暂停超导金属层的沉积，以在完成之前进行冷却。 可以通过在超导金属层中图案化对准标记物来对准多个层。

    SYSTEMS, METHODS, AND APPARATUS FOR CRYOGENIC REFRIGERATION
    8.
    发明申请
    SYSTEMS, METHODS, AND APPARATUS FOR CRYOGENIC REFRIGERATION 有权
    低温制冷系统，方法和装置

    公开(公告)号：US20130231249A1

    公开(公告)日：2013-09-05

    申请号：US13863218

    申请日：2013-04-15

    申请人： D-WAVE SYSTEMS INC.

    发明人： Randall C. Black ,  Jeremy P. Hilton ,  Geordie Rose

    IPC分类号： F25B9/12 ,  H01L39/02

    CPC分类号： F25B9/12 ,  F25B9/10 ,  G06F1/20 ,  G06F2200/201 ,  H01L39/02 ,  H05K7/20372

    摘要： Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system.

    摘要翻译： 低温制冷采用脉冲管冷冻机和稀释冰箱来提供极低温度的冷却，例如冷却超导处理器。 可以使用多个吸附泵实现连续低温循环制冷。 各种改进可以包括多个不同的热连接点，具有冷却结构的蒸发罐，和/或可以与吸附泵成一体的一个或多个气隙热交换器。 当系统温度超过低温温度时，储存器容积可以提供压力释放，从而减小系统的质量。 可以提供用于冷凝和蒸发的附加热交换器和/或单独路径。 可以使用多通道连接器，和/或由在低温下具有高比热容的再生材料形成的连接器。 柔性PCB可以提供体现温度梯度的部件的热连接。 可以例如经由可切换热化系统预先冷却各种部件。