发明申请
- 专利标题: SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
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申请号: US15289782申请日: 2016-10-10
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公开(公告)号: US20170098682A1公开(公告)日: 2017-04-06
- 发明人: Eric Ladizinsky , Geordie Rose , Jeremy P. Hilton , Eugene Dantsker , Byong Hyop Oh
- 申请人: D-Wave Systems Inc.
- 主分类号: H01L27/18
- IPC分类号: H01L27/18 ; G06N99/00 ; H01L39/24 ; H01L39/02 ; H01L39/22
摘要:
Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
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