Invention Application
- Patent Title: Manufacturing a package using plateable encapsulant
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Application No.: US15448018Application Date: 2017-03-02
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Publication No.: US20170256472A1Publication Date: 2017-09-07
- Inventor: Sook Woon CHAN , Chau Fatt CHIANG , Kok Yau CHUA , Soon Lock GOH , Swee Kah LEE , Joachim MAHLER , Mei Chin NG , Beng Keh SEE , Guan Choon Matthew Nelson TEE
- Applicant: Infineon Technologies AG
- Priority: DE102016103790.7 20160303
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/29 ; H01L23/552 ; H01L21/56 ; C23C18/16 ; C09D5/00 ; C09D201/00 ; C23C18/34 ; C23C18/18 ; H01L23/66 ; H01L23/00
Abstract:
A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.
Public/Granted literature
- US10396007B2 Semiconductor package with plateable encapsulant and a method for manufacturing the same Public/Granted day:2019-08-27
Information query
IPC分类:
