公开(公告)号：US20240006260A1

公开(公告)日：2024-01-04

申请号：US18144578

申请日：2023-05-08

申请人： Infineon Technologies AG

发明人： Chee Hong LEE ,  Soon Lock GOH ,  Chai Chee LEE ,  Swee Kah LEE ,  Luay Kuan ONG ,  Chee Voon TAN

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49562

摘要： A package is disclosed. In one example, the package includes an electronic component and an encapsulant encapsulating at least part of the electronic component. A first electrically conductive structure is arranged on one side of the electronic component, a second electrically conductive structure arranged on an opposing other side of the electronic component and being electrically coupled with the electronic component, and at least one sidewall recess at the encapsulant. The first electrically conductive structure and the second electrically conductive structure are configured to be at different electric potentials during operation of the package. The first electrically conductive structure and the second electrically conductive structure are exposed at opposing main surfaces of the encapsulant.

公开(公告)号：US20170256472A1

公开(公告)日：2017-09-07

申请号：US15448018

申请日：2017-03-02

申请人： Infineon Technologies AG

发明人： Sook Woon CHAN ,  Chau Fatt CHIANG ,  Kok Yau CHUA ,  Soon Lock GOH ,  Swee Kah LEE ,  Joachim MAHLER ,  Mei Chin NG ,  Beng Keh SEE ,  Guan Choon Matthew Nelson TEE

IPC分类号： H01L23/31 ,  H01L23/29 ,  H01L23/552 ,  H01L21/56 ,  C23C18/16 ,  C09D5/00 ,  C09D201/00 ,  C23C18/34 ,  C23C18/18 ,  H01L23/66 ,  H01L23/00

CPC分类号： H01L23/3192 ,  C09D5/002 ,  C09D5/24 ,  C09D201/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1637 ,  C23C18/166 ,  C23C18/1689 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1837 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  H01L21/56 ,  H01L21/568 ,  H01L23/293 ,  H01L23/295 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16501 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/81

摘要： A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

公开(公告)号：US20190341324A1

公开(公告)日：2019-11-07

申请号：US16514853

申请日：2019-07-17

申请人： Infineon Technologies AG

发明人： Sook Woon CHAN ,  Chau Fatt CHIANG ,  Kok Yau CHUA ,  Soon Lock GOH ,  Swee Kah LEE ,  Joachim MAHLER ,  Mei Chin NG ,  Beng Keh SEE ,  Guan Choon Matthew Nelson TEE

IPC分类号： H01L23/31 ,  H01L23/29 ,  C23C18/18 ,  C23C18/16 ,  C09D5/24 ,  C09D5/00 ,  C09D201/00 ,  H01L21/56 ,  C23C18/34 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00

摘要： A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

公开(公告)号：US20150344730A1

公开(公告)日：2015-12-03

申请号：US14287231

申请日：2014-05-27

申请人： Infineon Technologies AG

发明人： Swee Kah LEE ,  Joachim MAHLER ,  Chew Theng TAI ,  Yik Yee TAN ,  Soon Lock GOH ,  Poh Cheng LIM ,  Jagen KRISHNAN ,  Peh Hean TEH

IPC分类号： C09D179/04 ,  H01L23/29 ,  H01L21/56 ,  C09D163/00 ,  C09D5/08

CPC分类号： C09D179/04 ,  C08G14/06 ,  C09D5/002 ,  C09D5/08 ,  C09D161/34 ,  C09D163/00 ,  H01L21/565 ,  H01L23/296 ,  H01L23/3142 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08K5/544 ,  C08L63/00

摘要： A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.

摘要翻译： 提供底漆组合物。 底漆组合物包括至少一种双官能或多官能苯并恶嗪化合物; 和至少一种包含对金属表面具有亲和性的官能团的化合物和可交联基团。 还提供了在半导体器件上形成底漆层的方法以及封装半导体器件的方法。